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IFX1040SJXUMA1

Infineon Technologies

IFX1040SJXUMA1 by Infineon Technologies

IFX1040SJXUMA1 by Infineon Technologies is a Network Interface with 8 terminals, operating temperature range of -40 to 125°C, and supply voltage of 5V. It is used in automotive applications for interface circuits due to its small outline package and gull wing terminal form.

Median Price

$0.807

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70,839 parts In-Stock

1+ parts

-

100+ parts

$0.778

1k+ parts

$0.646

10k+ parts

$0.576

70,839

-

$0.778

$0.646

$0.576

DigiKey

USA . 70,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.970

10k+ parts

-

70,839

-

-

$0.970

-

Verical

USA . 70,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.807

10k+ parts

$0.720

70,839

-

-

$0.807

$0.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 963 parts In-Stock

1+ parts

$0.606

100+ parts

-

1k+ parts

-

10k+ parts

-

963

$0.606

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.000

-

-

-

Bristol Electronics

USA . 2,450 parts In-Stock

1+ parts

$1.688

100+ parts

$0.624

1k+ parts

$0.439

10k+ parts

-

2,450

$1.688

$0.624

$0.439

-

Vyrian

USA . 8,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,408

-

-

-

-

Chip Stock

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 2,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,450

-

-

-

-

Dan-Mar Components

USA . 2,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,450

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 70,737 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

-

10k+ parts

-

70,737

$0.540

-

-

-

Corphita

USA . 614 parts In-Stock

1+ parts

$0.574

100+ parts

-

1k+ parts

-

10k+ parts

-

614

$0.574

-

-

-

Component Stockers USA

USA . 27,882 parts In-Stock

1+ parts

$0.650

100+ parts

$0.610

1k+ parts

$0.550

10k+ parts

$0.550

27,882

$0.650

$0.610

$0.550

$0.550

Argo Parts USA

USA . 2,387 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

2,387

$1.000

-

-

-

Continental Prestige Electronics

USA . 2,341 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

$0.980

2,341

$1.000

-

-

$0.980

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.000

-

-

-

AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$11.940

100+ parts

-

1k+ parts

-

10k+ parts

-

838

$11.940

-

-

-

Modulus Dynamics

Lithuania . 2,522 parts In-Stock

1+ parts

$12.527

100+ parts

$12.026

1k+ parts

$11.525

10k+ parts

-

2,522

$12.527

$12.026

$11.525

-

Perfect Parts

USA . 13,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,395

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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500

-

-

-

-

Microchip USA

USA . 477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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477

-

-

-

-

Overview

Unlock seamless connectivity and superior performance with the IFX1040SJXUMA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in every product. This Network Interface module offers endless possibilities for applications in automotive and industrial settings. Experience the value of fast and efficient data transfer, enhanced connectivity, and optimized performance. Upgrade your systems with Infineon's IFX1040SJXUMA1 and elevate your network capabilities to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body makes this product lightweight and durable.

Surface Mount: YES

With the ability for surface mounting, this product is easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on the circuit board.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for various networking applications.

Package Style: SMALL OUTLINE

The small outline package style enables a compact design for tighter spaces in electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand rigorous conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: TIN

The use of tin terminal finish provides excellent conductivity for optimal signal transmission.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and ensures secure connections.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim profile, ideal for space-constrained applications.

Technical Specifications

Network Interfaces IFX1040SJXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

IFX1040SJXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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