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NB3N853531EDTG

Onsemi

NB3N853531EDTG by Onsemi

NB3N853531EDTG clock generator by Onsemi operates at 266MHz with a supply voltage range of 3.135V to 3.465V. This CMOS technology device is ideal for industrial applications, featuring a small outline package with 20 terminals and operating temperatures from -40 °C to 85°C. It is surface mountable and has a terminal finish of nickel palladium gold for reliable performance in various electronic systems.

Median Price

$6.738

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,612 parts In-Stock

1+ parts

-

100+ parts

$5.990

1k+ parts

$5.360

10k+ parts

$5.040

20,612

-

$5.990

$5.360

$5.040

Verical

USA . 7,725 parts In-Stock

1+ parts

-

100+ parts

$7.487

1k+ parts

$6.700

10k+ parts

-

7,725

-

$7.487

$6.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,238 parts In-Stock

1+ parts

$6.327

100+ parts

-

1k+ parts

-

10k+ parts

-

1,238

$6.327

-

-

-

Vyrian

USA . 4,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,172

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 855 parts In-Stock

1+ parts

$5.994

100+ parts

-

1k+ parts

-

10k+ parts

-

855

$5.994

-

-

-

Corohmni

South Africa . 246 parts In-Stock

1+ parts

$6.590

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$6.590

-

-

-

Component Stockers USA

USA . 13,794 parts In-Stock

1+ parts

$6.880

100+ parts

$6.470

1k+ parts

$5.850

10k+ parts

$5.850

13,794

$6.880

$6.470

$5.850

$5.850

AZTECH Wire

Italy . 143 parts In-Stock

1+ parts

$9.740

100+ parts

-

1k+ parts

-

10k+ parts

-

143

$9.740

-

-

-

Continental Prestige Electronics

USA . 20,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,612

-

-

-

-

Kulean Microsystems

USA . 7,405 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,405

-

-

-

-

Problanco Electronics

Mexico . 4,254 parts In-Stock

1+ parts

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100+ parts

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4,254

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TANS Electronics

Latvia . 3,849 parts In-Stock

1+ parts

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100+ parts

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3,849

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-

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UHIMA Technologies

Türkiye . 784 parts In-Stock

1+ parts

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100+ parts

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784

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Microchip USA

USA . 303 parts In-Stock

1+ parts

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303

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SupplyDigital Components

Austria . 133 parts In-Stock

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133

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iodParts Technologies Inc.

India . 75 parts In-Stock

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75

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Perfect Parts

USA . 73 parts In-Stock

1+ parts

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73

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Overview

Discover the ultimate solution for your clock generation needs with the NB3N853531EDTG by Onsemi. Crafted with precision and expertise, this clock generator offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides exceptional performance and efficiency. Say goodbye to downtime and hello to seamless operations with this cutting-edge technology. Upgrade your systems today and experience the difference with Onsemi's NB3N853531EDTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the product is lightweight, making it easy to integrate into different electronic devices.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 3.465 V

Provides a stable power supply for reliable operation.

Package Shape: RECTANGULAR

Compact design for efficient space utilization.

No. of Terminals: 20

Sufficient connections for versatile functionality and integration.

Minimum Supply Voltage: 3.135 V

Allows for a wide operating range, accommodating different power supply conditions.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ability to operate in low-temperature conditions for versatility in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Enhances connectivity options and flexibility in system design.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 4.4 mm

Compact size for easy integration into electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow conditions for reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

Suitable temperature for component assembly without risk of damage.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with high temperature fluctuations.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Versatile functionality for clock generation and other peripheral functions.

Technology: CMOS

Low power consumption and high noise immunity for efficient performance.

Terminal Form: GULL WING

Facilitates easy PCB mounting and soldering for simplified assembly.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with various electronic systems.

Terminal Pitch: 0.65 mm

Fine pitch spacing for high-density PCB designs.

Nominal Primary Clock/Crystal Frequency: 266 MHz

Provides a stable clock signal for precise timing in electronic devices.

Technical Specifications

Clock Generators NB3N853531EDTG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

266 MHz

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

NB3N853531EDTG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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