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NB3N51032DTG

Onsemi

NB3N51032DTG by Onsemi

NB3N51032DTG clock generator by Onsemi operates at a max output frequency of 200 MHz with a supply voltage range of 3.135V to 3.465V. This CMOS technology device, suitable for industrial applications, comes in a small outline package with 16 terminals and can withstand temperatures from -40°C to 85°C.

Median Price

$2.030

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 311 parts In-Stock

1+ parts

$1.609

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-

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311

$1.609

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Chip1Stop

Japan . 361 parts In-Stock

1+ parts

$2.030

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$1.629

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361

$2.030

$1.629

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DigiKey

USA . 134 parts In-Stock

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$3.770

100+ parts

$2.366

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134

$3.770

$2.366

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Mouser Electronics

USA . 74 parts In-Stock

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$3.770

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$2.620

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74

$3.770

$2.620

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Rochester

USA . 949 parts In-Stock

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-

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$1.880

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$1.680

10k+ parts

$1.580

949

-

$1.880

$1.680

$1.580

Verical

USA . 311 parts In-Stock

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311

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Distributors (In-Stock)

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Digiode

USA . 1,668 parts In-Stock

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$1.835

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$1.835

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Vyrian

USA . 4,867 parts In-Stock

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4,867

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Flip Electronics

USA . 4,224 parts In-Stock

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TME

Poland . 288 parts In-Stock

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$3.139

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$3.137

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288

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$3.139

$3.137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 879 parts In-Stock

1+ parts

$1.739

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879

$1.739

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Corohmni

South Africa . 135 parts In-Stock

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$1.755

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135

$1.755

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$40.292

100+ parts

$36.666

1k+ parts

$33.039

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3,000

$40.292

$36.666

$33.039

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QUARKTWIN TECHNOLOGY LTD

USA . 26,514 parts In-Stock

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TANS Electronics

Latvia . 8,284 parts In-Stock

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Problanco Electronics

Mexico . 4,930 parts In-Stock

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Kulean Microsystems

USA . 3,537 parts In-Stock

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SupplyDigital Components

Austria . 1,971 parts In-Stock

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Perfect Parts

USA . 1,880 parts In-Stock

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1,880

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GreenTree Electronics

Israel . 333 parts In-Stock

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Authorized Procurement Solutions

USA . 233 parts In-Stock

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UHIMA Technologies

Türkiye . 90 parts In-Stock

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90

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Overview

Elevate your clock generation needs with the NB3N51032DTG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality clock generators that offer precise timing solutions for a wide range of applications. From telecommunications to networking, this product ensures reliable performance and optimal efficiency. Experience the value and benefits of Onsemi's clock generators, providing customers with high-performance solutions that drive success. Trust in Onsemi for superior quality and unparalleled reliability in clock generation technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and lightweight design, making the Clock Generator easy to handle and install.

Surface Mount: YES

Surface mount capability allows for efficient and space-saving installation on PCBs, making it ideal for compact electronic devices.

Maximum Supply Voltage: 3.465 V

High maximum supply voltage tolerance provides flexibility for different power supply configurations, ensuring stable performance.

Maximum Output Clock Frequency: 200 MHz

High maximum output clock frequency enables the Clock Generator to support high-performance applications that require fast and accurate timing.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the Clock Generator to function reliably in extreme cold conditions without performance degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the Clock Generator energy-efficient and reliable in various industrial settings.

Nominal Primary Clock/Crystal Frequency: 25 MHz

Stable and precise primary clock/crystal frequency ensures accurate timing and synchronization for interconnected electronic components.

Technical Specifications

Clock Generators NB3N51032DTG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

25 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

NB3N51032DTG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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