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MTP4N50E

Onsemi

MTP4N50E by Onsemi

MTP4N50E by Onsemi is a N-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 10A, EAS of 280mJ, and ID of 4A. With a max power dissipation of 75W and operating temperature up to 150 °C, it offers reliable performance in various electronic systems.

Median Price

$11.540

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 15 parts In-Stock

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$11.540

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$8.650

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ACDS - Activité Composants Distribution Service

France . 2,900 parts In-Stock

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Zilex Electronics Inc.

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Vyrian

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Digiode

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Lantek

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North Shore Components

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Semi Source

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Standard Data Resources

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Electro Mavin

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Inland Empire Components Inc.

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Electronic Expediters

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Corohmni

South Africa . 87 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Corphita

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Problanco Electronics

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Kulean Microsystems

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 934 parts In-Stock

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SupplyDigital Components

Austria . 519 parts In-Stock

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GreenTree Electronics

Israel . 300 parts In-Stock

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Overview

Experience the reliable performance and high-quality design of the MTP4N50E by Onsemi, a leading manufacturer in the field of Power Field Effect Transistors (FET). This N-CHANNEL transistor is perfect for switching applications and comes with a built-in diode for added convenience. With a maximum power dissipation of 75W and a minimum DS breakdown voltage of 500V, this transistor offers exceptional value and benefits for your projects. Trust Onsemi to deliver top-notch technology that meets your needs with precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power electronics due to their higher electron mobility and faster switching speeds compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse current flow, making it a versatile choice for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high efficiency and reliable performance in controlling power flow.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high voltage levels, making it suitable for applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and space-saving design, making it suitable for compact electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides a strong and reliable connection, perfect for applications where mechanical strength is crucial.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers fast switching speeds and low power consumption, making it suitable for high-frequency applications.

Maximum Pulsed Drain Current (IDM): 10 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current, ensuring reliable operation under varying load conditions.

Avalanche Energy Rating (EAS): 280 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes, providing protection against voltage transients.

Maximum Drain Current (Abs) (ID): 4 A

The maximum drain current rating of 4 A allows for efficient power handling, making it suitable for medium-power applications.

Maximum Power Dissipation (Abs): 75 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy installation and secure mounting, making it suitable for applications where stability is important.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making it ideal for demanding power electronic applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can function in harsh environments without compromising performance or reliability.

Transistor Element Material: SILICON

Silicon-based transistor element material ensures high conductivity and temperature stability, making it suitable for high-power applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Maximum Drain-Source On Resistance: 1.5 ohm

Low on-resistance minimizes power loss and heat generation, making it ideal for high-efficiency power electronics circuits.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, ensuring easy integration into existing circuits or systems.

Case Connection: DRAIN

The drain connection allows for easy current flow control and efficient power handling, making it suitable for switching applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, this FET is easy to solder and rework, ensuring quick and reliable assembly.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures strong solder joints and reliable connections, making it suitable for harsh operating environments.

Technical Specifications

Power Field Effect Transistors (FET) MTP4N50E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

280 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP4N50E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-191-3344, 5961011913344

NIIN

011913344

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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