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MTP4N40E

Onsemi

MTP4N40E by Onsemi

MTP4N40E by Onsemi is a N-CHANNEL Power FET with 400V DS Breakdown Voltage. It features 14A IDM, 200mJ EAS, and 1.8 ohm RDS(on). Ideal for SWITCHING applications, this transistor operates in ENHANCEMENT MODE with a max power dissipation of 74W.

Median Price

$0.452

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,283 parts In-Stock

1+ parts

-

100+ parts

$0.436

1k+ parts

$0.362

10k+ parts

$0.323

2,283

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$0.436

$0.362

$0.323

DigiKey

USA . 2,283 parts In-Stock

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$0.550

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2,283

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$0.550

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Verical

USA . 2,283 parts In-Stock

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$0.452

10k+ parts

$0.403

2,283

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$0.452

$0.403

Distributors (In-Stock)

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Digiode

USA . 444 parts In-Stock

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$0.339

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$0.339

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Vyrian

USA . 1,033 parts In-Stock

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$0.357

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DigiKey Marketplace

USA . 2,983 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 48 parts In-Stock

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Corphita

USA . 1,809 parts In-Stock

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$0.321

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$0.321

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Corohmni

South Africa . 139 parts In-Stock

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$0.357

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139

$0.357

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,223 parts In-Stock

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TANS Electronics

Latvia . 7,096 parts In-Stock

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SupplyDigital Components

Austria . 6,783 parts In-Stock

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Kulean Microsystems

USA . 6,033 parts In-Stock

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Problanco Electronics

Mexico . 3,053 parts In-Stock

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Infinite Electronics LLP (Excess)

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Standard Data Resources (Excess)

USA . 1,086 parts In-Stock

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Perfect Parts

USA . 254 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Overview

Experience the power and reliability of the MTP4N40E by Onsemi, a top-of-the-line Power Field Effect Transistor designed for switching applications. Manufactured with precision and quality in mind, this N-Channel transistor offers a built-in diode for added convenience. With a maximum pulsing drain current of 14A and a minimum breakdown voltage of 400V, this transistor is perfect for a wide range of industrial and commercial applications. Trust in Onsemi to deliver superior performance and efficiency with the MTP4N40E, providing you with the value and benefits you need to succeed in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance and lower resistance compared to P-Channel transistors.

Minimum DS Breakdown Voltage: 400 V

High breakdown voltage allows the transistor to handle higher voltages without failure, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 14 A

High pulsed drain current rating means the transistor can handle short bursts of high current, making it suitable for applications with high peak power requirements.

Maximum Power Dissipation (Abs): 74 W

High power dissipation rating allows the transistor to handle high power levels without overheating, ensuring reliability in high-power applications.

Maximum Operating Temperature: 150 °C

High operating temperature rating allows the transistor to operate in harsh environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) MTP4N40E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

1.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

14 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP4N40E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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