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MRF181ZR1

Onsemi

MRF181ZR1 by Onsemi

MRF181ZR1 by Onsemi is an N-CHANNEL RF Power FET with a 65V DS Breakdown Voltage. It operates in the Ultra High Frequency Band and has a max Drain Current of 2A, making it ideal for amplifier applications. The transistor features a CERAMIC, METAL-SEALED COFIRED package with GULL WING terminals for surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,243 parts In-Stock

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Digiode

USA . 1,229 parts In-Stock

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One Stop Electronics

USA . 1,149 parts In-Stock

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$24.050

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Kulean Microsystems

USA . 6,570 parts In-Stock

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TANS Electronics

Latvia . 6,224 parts In-Stock

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SupplyDigital Components

Austria . 4,905 parts In-Stock

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Problanco Electronics

Mexico . 3,606 parts In-Stock

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Corphita

USA . 2,399 parts In-Stock

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Corohmni

South Africa . 211 parts In-Stock

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UHIMA Technologies

Türkiye . 97 parts In-Stock

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Overview

Unlock the potential of your RF power applications with the MRF181ZR1 by Onsemi. Crafted with precision and expertise, this N-CHANNEL FET offers unparalleled performance and reliability. From amplifiers to ultra-high frequency bands, this transistor is the ideal choice for your projects. With a minimum DS breakdown voltage of 65V and a maximum drain current of 2A, this product delivers exceptional value and benefits to customers looking for quality and efficiency in their designs. Trust Onsemi to provide innovative solutions that meet your needs seamlessly.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides excellent durability and heat dissipation, ensuring the longevity and reliability of the RF Power FET.

Polarity or Channel Type: N-CHANNEL

N-channel RF Power FETs typically offer better performance and efficiency compared to P-channel types, making this product a good choice for high-power amplification applications.

Configuration: SINGLE

The single configuration simplifies circuit design and makes integration into existing systems more straightforward, enhancing overall usability.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this RF Power FET is optimized to deliver high output power with minimal distortion, making it ideal for RF amplification tasks.

Surface Mount: YES

The surface mount capability enables easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65 V, this RF Power FET can handle high voltages, making it suitable for high-power RF amplification tasks.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and mounting on PCBs, optimizing space utilization and facilitating efficient circuit layouts.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection during soldering, ensuring stable electrical performance under varying operating conditions.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for precise control of the RF Power FET's output power, enabling efficient power amplification with minimal signal distortion.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for use in the ultra-high frequency band, this RF Power FET offers excellent performance and signal integrity in high-frequency RF applications.

No. of Terminals: 2

With only 2 terminals, this RF Power FET is easy to integrate into circuits and requires minimal complex wiring, simplifying installation and usage.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements on the PCB, making it suitable for compact electronic devices and systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of metal-oxide semiconductor technology ensures high performance, low power consumption, and excellent reliability in RF power amplification applications.

Transistor Element Material: SILICON

Silicon transistors offer high thermal stability, low noise, and excellent performance characteristics, making this RF Power FET a reliable choice for demanding applications.

Maximum Drain Current (ID): 2 A

With a maximum drain current of 2 A, this RF Power FET can handle high currents, making it suitable for applications requiring high-power output.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and easy integration into circuit layouts, enhancing the overall versatility of the RF Power FET.

Case Connection: SOURCE

The source case connection simplifies the grounding and biasing of the RF Power FET, ensuring stable and consistent performance under varying operating conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF181ZR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF181ZR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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