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MPSH17RLRA

Onsemi

MPSH17RLRA by Onsemi

MPSH17RLRA by Onsemi is an NPN RF BJT transistor with a max fT of 800 MHz. It has a Pdiss of 0.625 W and VCEO of 15 V, ideal for amplifier applications in the very high frequency band. The package is cylindrical with through-hole terminals and can operate up to 150 °C.

Median Price

$0.053

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

8,000

-

$0.053

$0.044

$0.039

DigiKey

USA . 8,000 parts In-Stock

1+ parts

-

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$0.070

8,000

-

-

-

$0.070

Verical

USA . 8,000 parts In-Stock

1+ parts

-

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$0.049

8,000

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-

-

$0.049

Distributors (In-Stock)

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Vyrian

USA . 590 parts In-Stock

1+ parts

$0.039

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-

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590

$0.039

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Digiode

USA . 1,834 parts In-Stock

1+ parts

$0.041

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1,834

$0.041

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Distributors (Availability)

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Corphita

USA . 1,367 parts In-Stock

1+ parts

$0.039

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-

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1,367

$0.039

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Corohmni

South Africa . 455 parts In-Stock

1+ parts

$0.039

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455

$0.039

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QUARKTWIN TECHNOLOGY LTD

USA . 28,082 parts In-Stock

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28,082

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Continental Prestige Electronics

USA . 8,000 parts In-Stock

1+ parts

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$0.052

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8,000

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-

$0.052

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Problanco Electronics

Mexico . 6,979 parts In-Stock

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6,979

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Kulean Microsystems

USA . 3,873 parts In-Stock

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3,873

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TANS Electronics

Latvia . 3,764 parts In-Stock

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3,764

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UHIMA Technologies

Türkiye . 504 parts In-Stock

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SupplyDigital Components

Austria . 247 parts In-Stock

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Overview

Enhance your RF signal amplification with the MPSH17RLRA by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality in their RF Small Signal Bipolar Junction Transistors. Ideal for amplifier applications in the very high-frequency band, this NPN transistor offers a reliable and efficient solution for your electronic projects. With a maximum operating temperature of 150 °C and a nominal transition frequency of 800 MHz, the MPSH17RLRA provides exceptional performance and value to customers seeking high-quality components for their designs. Experience the unmatched benefits of Onsemi's trusted technology with the MPSH17RLRA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the transistor lightweight and durable, ideal for portable and rugged applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and layout, making it easier to integrate into electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and reliability in amplification circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure and reliable connection, making it easy to solder onto printed circuit boards.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand harsh environmental conditions and operate reliably in various applications.

Nominal Transition Frequency (fT): 800 MHz

The high transition frequency allows for fast switching speeds and high-frequency performance in amplification circuits.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH17RLRA attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.9 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

25

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH17RLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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