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MMSF7P03HDR2

Onsemi

MMSF7P03HDR2 by Onsemi

The Onsemi MMSF7P03HDR2 is a P-CHANNEL FET with 30V DS Breakdown Voltage, 50A IDM, and 0.035 ohm RDS. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating at up to 150 °C, it offers high power dissipation of 2.5W in a SMALL OUTLINE package.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Elcom Components

USA . 17,500 parts In-Stock

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Bristol Electronics

USA . 11,804 parts In-Stock

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11,804

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Dan-Mar Components

USA . 11,804 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Digiode

USA . 902 parts In-Stock

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Vyrian

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Kepictronics

USA . 78,500 parts In-Stock

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78,500

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,200 parts In-Stock

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Problanco Electronics

Mexico . 8,120 parts In-Stock

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TANS Electronics

Latvia . 4,075 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 1,250 parts In-Stock

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Corphita

USA . 712 parts In-Stock

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UHIMA Technologies

Türkiye . 679 parts In-Stock

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Kulean Microsystems

USA . 456 parts In-Stock

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Corohmni

South Africa . 414 parts In-Stock

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Overview

Experience the power of innovation with the MMSF7P03HDR2 by Onsemi, a high-quality P-Channel Power FET designed for switching applications. With a single configuration and built-in diode, this transistor offers seamless performance and reliability. Perfect for a wide range of electronic devices, this transistor delivers efficiency and durability, providing customers with exceptional value. Trust in Onsemi's expertise and elevate your products with the MMSF7P03HDR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Polarity or Channel Type: P-CHANNEL

Offers efficient switching capabilities and compatibility with a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor package.

Transistor Application: SWITCHING

Designed specifically for switching operations, ensuring optimal performance in this application.

Minimum DS Breakdown Voltage: 30 V

Withstands high voltages, making it suitable for various power-related tasks.

Surface Mount: YES

Easy to install and suitable for modern electronic devices that commonly use surface mount technology.

Maximum Pulsed Drain Current (IDM): 50 A

Capable of handling high currents during peak operation, ensuring reliability in demanding conditions.

Avalanche Energy Rating (EAS): 5000 mJ

Offers protection against energy spikes, enhancing the product's durability and longevity.

Maximum Power Dissipation (Abs): 2.5 W

Efficient power handling capability, reducing heat dissipation and improving overall performance.

Maximum Operating Temperature: 150 °C

Can operate effectively at high temperatures, suitable for applications where heat is a concern.

Technical Specifications

Power Field Effect Transistors (FET) MMSF7P03HDR2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

5000 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMSF7P03HDR2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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