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MMSF3300R2

Onsemi

MMSF3300R2 by Onsemi

The Onsemi MMSF3300R2 is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 50A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.0125 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it has an EAS of 500mJ and can handle up to 6.7A drain current.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Extreme Components

USA . 18,244 parts In-Stock

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Bristol Electronics

USA . 9,800 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,078 parts In-Stock

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Dan-Mar Components

USA . 2,078 parts In-Stock

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Vyrian

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J & M Industries LLC

USA . 700 parts In-Stock

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700

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Resion

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Digiode

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R&J Components

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Cogito LLC

Ukraine . 4 parts In-Stock

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Kepictronics

USA . 24,000 parts In-Stock

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Kulean Microsystems

USA . 6,865 parts In-Stock

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Problanco Electronics

Mexico . 6,822 parts In-Stock

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TANS Electronics

Latvia . 3,497 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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SupplyDigital Components

Austria . 2,305 parts In-Stock

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Corphita

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Cyclops Electronics Ltd (Excess)

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Metaverse IC Inc.

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UHIMA Technologies

Türkiye . 554 parts In-Stock

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Overview

Enhance your electronic devices with the MMSF3300R2 by Onsemi, a top-quality Power Field Effect Transistor that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor with a built-in diode is ideal for switching applications. With a high breakdown voltage of 30V and a maximum pulsated drain current of 50A, this transistor delivers superior efficiency and durability. Upgrade your electronics with the MMSF3300R2 and experience the benefits of enhanced power management and improved functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and control in the N-channel configuration.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow.

Transistor Application: SWITCHING

Ideal for applications where rapid switching between on and off states is required.

Maximum Pulsed Drain Current (IDM): 50 A

Capable of handling high current pulses, making it suitable for power applications.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without degradation in performance.

Technical Specifications

Power Field Effect Transistors (FET) MMSF3300R2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA LOW RESISTANCE, LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

6.7 A

Maximum Drain Current (ID):

6.7 A

Maximum Drain-Source On Resistance:

.0125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMSF3300R2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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