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MICROFC-30035-SMT-TR1

Onsemi

MICROFC-30035-SMT-TR1 by Onsemi

MICROFC-30035-SMT-TR1 by Onsemi is a 3 mm square avalanche photodiode with a peak wavelength of 420 nm. It has a max operating temperature of 85°C and a min reverse breakdown voltage of 24.2 V. This photodiode is suitable for applications requiring high sensitivity in low light conditions, such as optical communication systems or medical imaging devices.

Median Price

$43.940

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 93 parts In-Stock

1+ parts

$39.539

100+ parts

$35.481

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-

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93

$39.539

$35.481

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Mouser Electronics

USA . 84 parts In-Stock

1+ parts

$43.270

100+ parts

$38.130

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-

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84

$43.270

$38.130

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Master Electronics

USA . 20 parts In-Stock

1+ parts

$44.610

100+ parts

$37.160

1k+ parts

$36.970

10k+ parts

-

20

$44.610

$37.160

$36.970

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DigiKey

USA . 3 parts In-Stock

1+ parts

$47.020

100+ parts

$38.138

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3

$47.020

$38.138

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Element14

Singapore . 30 parts In-Stock

1+ parts

$49.598

100+ parts

$40.373

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30

$49.598

$40.373

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Chip1Stop

Japan . 48 parts In-Stock

1+ parts

$62.100

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$39.300

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48

$62.100

$39.300

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Rochester

USA . 196 parts In-Stock

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-

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$34.820

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$31.150

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$29.320

196

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$34.820

$31.150

$29.320

Verical

USA . 19 parts In-Stock

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Farnell

UK . 12 parts In-Stock

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$31.260

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12

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$31.260

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Distributors (In-Stock)

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Digiode

USA . 1,748 parts In-Stock

1+ parts

$36.746

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1,748

$36.746

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Nova Conductors

Japan . 80 parts In-Stock

1+ parts

$43.270

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-

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80

$43.270

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TME

Poland . 93 parts In-Stock

1+ parts

$58.800

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93

$58.800

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IBS Electronics

USA . 20 parts In-Stock

1+ parts

$64.865

100+ parts

$54.033

1k+ parts

$53.756

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20

$64.865

$54.033

$53.756

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Vyrian

USA . 12,145 parts In-Stock

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Flip Electronics

USA . 986 parts In-Stock

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986

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,868 parts In-Stock

1+ parts

$0.050

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2,868

$0.050

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Ampacity Inc.

Singapore . 12 parts In-Stock

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$26.570

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12

$26.570

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Corohmni

South Africa . 365 parts In-Stock

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$31.260

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365

$31.260

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Corphita

USA . 259 parts In-Stock

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$34.812

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259

$34.812

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$43.270

100+ parts

$42.405

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2,000

$43.270

$42.405

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Problanco Electronics

Mexico . 6,850 parts In-Stock

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6,850

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Kulean Microsystems

USA . 4,826 parts In-Stock

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4,826

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Argo Parts USA

USA . 4,626 parts In-Stock

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4,626

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TANS Electronics

Latvia . 3,917 parts In-Stock

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SupplyDigital Components

Austria . 3,693 parts In-Stock

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3,693

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UHIMA Technologies

Türkiye . 810 parts In-Stock

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810

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Continental Prestige Electronics

USA . 10 parts In-Stock

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10

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Overview

Experience the exceptional quality and performance of the MICROFC-30035-SMT-TR1 by Onsemi. As a trusted manufacturer in the industry, Onsemi is known for delivering top-notch products that meet rigorous standards. The MICROFC-30035-SMT-TR1 belongs to the photodiode category and offers numerous applications. With its compact size of 3mm and peak wavelength of 420nm, this avalanche photodiode is perfect for demanding optoelectronic projects. It operates flawlessly in temperatures ranging from -40 to 85°C and features a minimum reverse breakdown voltage of 24.2V. Benefit from its low dark current of just 443nA and easy surface mount installation. Trust Onsemi to provide you with reliable, high-quality solutions that exceed your expectations.

Feature Benefit Bullets

Configuration: COMPLEX

Complex configuration provides versatility and flexibility in various applications.

Size: 3 mm

Compact size allows for easy integration into different devices or systems.

Peak Wavelength (nm): 420

Peak wavelength of 420nm makes this photodiode suitable for specific light detection applications.

Optoelectronic Type: AVALANCHE PHOTODIODE

Avalanche photodiodes offer high sensitivity and fast response times, making them ideal for low light detection.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability even in harsh environments.

Minimum Reverse Breakdown Voltage: 24.2 V

Higher reverse breakdown voltage provides better protection against voltage spikes.

Shape: SQUARE

Square shape simplifies the mounting process and allows for precise alignment.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in a wide range of environmental conditions.

Maximum Dark Current: 443 nA

Low dark current minimizes noise and ensures accurate signal detection.

Packing Method: TR

TR packing method provides protection during shipping and handling, ensuring product arrives in optimal condition.

Semiconductor Material: Silicon

Silicon semiconductor material offers high sensitivity and stability for reliable performance.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation on PCBs or other surfaces.

Technical Specifications

Photodiodes MICROFC-30035-SMT-TR1 attributes and parameters. Explore more Photodiodes devices from Onsemi

Specs

Additional Features:

LOW NOISE

Configuration:

COMPLEX

Maximum Dark Current:

443 nA

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Peak Wavelength (nm):

420

Minimum Reverse Breakdown Voltage:

24.2 V

Semiconductor Material:

Silicon

Shape:

SQUARE

Size:

3 mm

Trade Compliance

MICROFC-30035-SMT-TR1 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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