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MC74VHC574DTG

Onsemi

MC74VHC574DTG by Onsemi

MC74VHC574DTG by Onsemi is an 8-bit bus driver with a propagation delay of 12ns at Vsup of 3.3V. It operates in industrial temperatures, supports a max frequency of 75MHz, and has a true output polarity. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

$0.574

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,915 parts In-Stock

1+ parts

$0.219

100+ parts

-

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1,915

$0.219

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Chip1Stop

Japan . 2,215 parts In-Stock

1+ parts

$0.627

100+ parts

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2,215

$0.627

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Mouser Electronics

USA . 156 parts In-Stock

1+ parts

$0.840

100+ parts

$0.472

1k+ parts

$0.416

10k+ parts

$0.394

156

$0.840

$0.472

$0.416

$0.394

DigiKey

USA . 225 parts In-Stock

1+ parts

$0.890

100+ parts

$0.519

1k+ parts

$0.452

10k+ parts

$0.409

225

$0.890

$0.519

$0.452

$0.409

Rochester

USA . 29,490 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.416

10k+ parts

$0.371

29,490

-

$0.502

$0.416

$0.371

Verical

USA . 13,875 parts In-Stock

1+ parts

-

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$0.521

10k+ parts

$0.464

13,875

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,356 parts In-Stock

1+ parts

$0.355

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2,356

$0.355

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Flip Electronics

USA . 5,700 parts In-Stock

1+ parts

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5,700

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Vyrian

USA . 2,794 parts In-Stock

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2,794

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Lakeland Logistics Inc

USA . 75 parts In-Stock

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75

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Bristol Electronics

USA . 75 parts In-Stock

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75

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 16,145 parts In-Stock

1+ parts

$0.030

100+ parts

$0.020

1k+ parts

$0.310

10k+ parts

$0.320

16,145

$0.030

$0.020

$0.310

$0.320

Ampacity Inc.

Singapore . 5,710 parts In-Stock

1+ parts

$0.318

100+ parts

-

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5,710

$0.318

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Corphita

USA . 1,745 parts In-Stock

1+ parts

$0.337

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1,745

$0.337

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Corohmni

South Africa . 339 parts In-Stock

1+ parts

$0.374

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339

$0.374

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QUARKTWIN TECHNOLOGY LTD

USA . 25,144 parts In-Stock

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25,144

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Continental Prestige Electronics

USA . 15,615 parts In-Stock

1+ parts

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100+ parts

$0.440

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15,615

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$0.440

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Kulean Microsystems

USA . 7,207 parts In-Stock

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7,207

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TANS Electronics

Latvia . 6,371 parts In-Stock

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6,371

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Perfect Parts

USA . 1,940 parts In-Stock

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1,940

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Problanco Electronics

Mexico . 642 parts In-Stock

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642

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UHIMA Technologies

Türkiye . 471 parts In-Stock

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471

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SupplyDigital Components

Austria . 198 parts In-Stock

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Overview

Unlock the power of seamless data transfer with the MC74VHC574DTG by Onsemi. Designed with precision and reliability in mind, this bus driver & transceiver is perfect for a wide range of applications. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this product delivers exceptional performance every time. Say goodbye to delays and hello to efficiency with the MC74VHC574DTG - your go-to solution for all your data transmission needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space on the circuit board.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement on the circuit board and efficient use of space.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Low load capacitance ensures efficient signal transmission and reduces power consumption.

No. of Bits: 8

8-bit compatibility allows for versatile communication and data processing capabilities.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages, making it flexible for use in different systems.

No. of Terminals: 20

A sufficient number of terminals for connecting to other components and devices in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile saves space on the circuit board and allows for dense packing of components.

Maximum I (ol): 8 Amp

High output current capability allows for driving of heavy loads or multiple devices.

Propagation Delay (tpd): 19 ns

Low propagation delay ensures fast and efficient signal transmission, improving overall system performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables reliable performance in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signal, enabling bus sharing and multi-master configurations.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures accurate signal processing and synchronization with other devices.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable contact and corrosion resistance for long-term durability.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and connection options.

No. of Ports: 2

Dual ports allow for versatile connectivity and communication options.

Maximum Seated Height: 1.2 mm

Low seated height saves space on the circuit board and enables compact device designs.

Width: 4.4 mm

Narrow width allows for efficient use of space on the circuit board and enables compact device designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other devices in the system.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for operation in lower power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering process within a specified time limit for reliable solder joints.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper solder joint formation and reliability during the manufacturing process.

Length: 6.5 mm

Compact length allows for efficient use of space on the circuit board and enables compact device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions and industrial environments.

Maximum Frequency At Nominal Supply: 75000000 Hz

High maximum frequency capability allows for high-speed communication and data processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder joints for stable connections.

Packing Method: RAIL

Rail packing method allows for easy handling, storage, and transportation of multiple components.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density mounting and compact circuit board designs.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage allows for operation in systems with higher voltage requirements.

Technical Specifications

Bus Driver & Transceivers MC74VHC574DTG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

MC74VHC574DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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