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MC74VHC373MELG

Onsemi

MC74VHC373MELG by Onsemi

MC74VHC373MELG by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a nominal voltage of 3.3V and has a propagation delay of 10.5 ns. With a small outline package style, it is suitable for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,498 parts In-Stock

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Digiode

USA . 1,641 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 994 parts In-Stock

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$21.510

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994

$21.510

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Component Stockers USA

USA . 714 parts In-Stock

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$99.990

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714

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SupplyDigital Components

Austria . 7,748 parts In-Stock

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Problanco Electronics

Mexico . 7,165 parts In-Stock

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TANS Electronics

Latvia . 6,076 parts In-Stock

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Microchip USA

USA . 4,235 parts In-Stock

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Kulean Microsystems

USA . 1,767 parts In-Stock

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Corphita

USA . 766 parts In-Stock

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Corohmni

South Africa . 251 parts In-Stock

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UHIMA Technologies

Türkiye . 234 parts In-Stock

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Overview

Upgrade your electronic projects with the MC74VHC373MELG from Onsemi, a leading manufacturer known for its top-quality components. As a Bus Driver & Transceiver, this product offers reliable performance and seamless integration for a wide range of applications. With a durable plastic/epoxy package body material and 3-STATE output characteristics, this component ensures efficient operation and versatility. Experience the value and benefits of Onsemi's MC74VHC373MELG in your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 10.5 ns

With a low propagation delay, this bus driver & transceiver can quickly transmit data signals, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes the installation of this product easier, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with a wide range of systems and devices, making it versatile for various applications.

Output Characteristics: 3-STATE

The 3-state output allows the bus driver & transceiver to effectively control the bus signals, enabling efficient communication and data transmission.

Technical Specifications

Bus Driver & Transceivers MC74VHC373MELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC74VHC373MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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