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MC74LCX373MEL

Onsemi

MC74LCX373MEL by Onsemi

MC74LCX373MEL by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a nominal voltage of 2.5V and has a propagation delay of 10.5ns. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package and dual terminal position.

Median Price

$0.178

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$0.185

1k+ parts

$0.153

10k+ parts

$0.137

10,000

-

$0.185

$0.153

$0.137

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.171

10,000

-

-

-

$0.171

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,391 parts In-Stock

1+ parts

$0.144

100+ parts

-

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1,391

$0.144

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Vyrian

USA . 3,902 parts In-Stock

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3,902

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,506 parts In-Stock

1+ parts

$0.137

100+ parts

-

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1,506

$0.137

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-

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Corohmni

South Africa . 402 parts In-Stock

1+ parts

$0.147

100+ parts

-

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402

$0.147

-

-

-

Component Stockers USA

USA . 11,069 parts In-Stock

1+ parts

$0.150

100+ parts

$0.150

1k+ parts

$0.130

10k+ parts

$0.130

11,069

$0.150

$0.150

$0.130

$0.130

AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$20.650

100+ parts

-

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712

$20.650

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$38.223

100+ parts

$34.783

1k+ parts

$31.343

10k+ parts

-

500

$38.223

$34.783

$31.343

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Continental Prestige Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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$0.127

10k+ parts

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10,000

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$0.127

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TANS Electronics

Latvia . 7,246 parts In-Stock

1+ parts

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7,246

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Problanco Electronics

Mexico . 5,654 parts In-Stock

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Kulean Microsystems

USA . 5,054 parts In-Stock

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5,054

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SupplyDigital Components

Austria . 2,008 parts In-Stock

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2,008

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Microchip USA

USA . 137 parts In-Stock

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137

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UHIMA Technologies

Türkiye . 13 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality MC74LCX373MEL Bus Driver & Transceiver by Onsemi. With a compact package body material and 8-bit configuration, this product offers fast propagation delay, true output polarity, and a wide operating temperature range. Perfect for industrial applications, this device provides reliable performance and efficiency. Trust Onsemi's expertise in semiconductor technology to deliver innovative solutions that meet your specific needs. Upgrade your projects today with the MC74LCX373MEL for seamless integration and optimal functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 8 ns

Fast propagation delay allows for quick signal transmission, improving overall performance.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates efficiently at a low supply voltage, reducing power consumption.

No. of Bits: 8

Provides sufficient data transfer capabilities for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Output Characteristics: 3-STATE

Offers flexibility in controlling the output signal, allowing for tri-state outputs.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers MC74LCX373MEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX373MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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