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MC74HCT541AFG

Onsemi

MC74HCT541AFG by Onsemi

MC74HCT541AFG by Onsemi is an 8-bit bus driver with 32ns propagation delay at 5V. It features a small outline package, operates in the temperature range of -55 to 125 °C, and has a max supply voltage of 5.5V. Ideal for applications requiring true output polarity and enable low control type.

Median Price

$0.471

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 974 parts In-Stock

1+ parts

-

100+ parts

$0.462

1k+ parts

$0.384

10k+ parts

$0.342

974

-

$0.462

$0.384

$0.342

Verical

USA . 974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.480

10k+ parts

$0.428

974

-

-

$0.480

$0.428

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 428 parts In-Stock

1+ parts

$0.360

100+ parts

-

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428

$0.360

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Vyrian

USA . 3,641 parts In-Stock

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3,641

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Distributors (Availability)

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Corphita

USA . 2,209 parts In-Stock

1+ parts

$0.341

100+ parts

-

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2,209

$0.341

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Corohmni

South Africa . 436 parts In-Stock

1+ parts

$0.379

100+ parts

-

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436

$0.379

-

-

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AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$9.680

100+ parts

-

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642

$9.680

-

-

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SupplyDigital Components

Austria . 7,818 parts In-Stock

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7,818

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Kulean Microsystems

USA . 1,508 parts In-Stock

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1,508

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Continental Prestige Electronics

USA . 1,360 parts In-Stock

1+ parts

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100+ parts

$0.329

1k+ parts

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1,360

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$0.329

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Problanco Electronics

Mexico . 1,090 parts In-Stock

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1,090

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UHIMA Technologies

Türkiye . 558 parts In-Stock

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558

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Microchip USA

USA . 346 parts In-Stock

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346

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TANS Electronics

Latvia . 62 parts In-Stock

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62

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Overview

Enhance your electronic projects with the MC74HCT541AFG by Onsemi, a high-quality bus driver & transceiver that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the demands of various applications with its advanced technology and innovative features. With a wide range of advantages such as fast propagation delay, low power consumption, and a compact package design, the MC74HCT541AFG delivers value and efficiency to customers looking for top-notch components. Upgrade your design with the MC74HCT541AFG and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the bus driver & transceivers, ensuring durability and longevity.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes it compatible with a wide range of digital systems and applications.

Maximum I (ol): 6 Amp

High output current capability allows the bus driver & transceivers to drive heavy loads or multiple devices without overheating or performance degradation.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other components in the system.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making it suitable for aerospace and defense applications.

Technical Specifications

Bus Driver & Transceivers MC74HCT541AFG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.275 mm

Trade Compliance

MC74HCT541AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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