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MC1455D

Onsemi

MC1455D by Onsemi

MC1455D by Onsemi is an Analog Waveform Generation IC with 8 terminals. It operates at a supply voltage range of 4.5V to 16V and has a temperature range of 0 °C to 70°C. This small outline package is ideal for pulse and rectangular waveform applications.

Median Price

$0.200

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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DF Sales Co.

USA . 130 parts In-Stock

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DF Sales Co.

USA . 130 parts In-Stock

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Vyrian

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Digiode

USA . 1,307 parts In-Stock

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Zilex Electronics Inc.

Canada . 914 parts In-Stock

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Electronic Expediters

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Elcom Components

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Inventory MP

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Bristol Electronics

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Electronics Depot

USA . 98 parts In-Stock

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Semi Source

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Resion

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ACDS - Activité Composants Distribution Service

France . 84 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 73 parts In-Stock

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Standard Data Resources

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MRC Electronics

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Odintec Ltd.

Israel . 4 parts In-Stock

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Corohmni

South Africa . 68 parts In-Stock

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Component Stockers USA

USA . 647 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,269 parts In-Stock

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SupplyDigital Components

Austria . 4,966 parts In-Stock

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Kulean Microsystems

USA . 3,291 parts In-Stock

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Problanco Electronics

Mexico . 3,063 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 705 parts In-Stock

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Corphita

USA . 681 parts In-Stock

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Overview

Experience the superior quality and precision of the MC1455D by Onsemi, a leading manufacturer in analog waveform generation. Ideal for a wide range of applications, this product offers unmatched value and performance. With its compact design and reliable technology, customers can trust in the MC1455D to deliver exceptional results every time. Upgrade your projects with the MC1455D and discover the difference that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, making it convenient for electronic assembly processes.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage ensures compatibility with standard electronic devices, providing a stable power source for reliable operation.

Power Supplies (V): 5/15

The availability of multiple power supply options (5V and 15V) gives flexibility in choosing the appropriate power source for different applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand higher temperature environments, making it suitable for a wide range of operating conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures reliable performance even in low temperature environments, enhancing the product's versatility.

Technology: BIPOLAR

The bipolar technology used in this product enables precise waveform generation and control, ensuring accurate signal output for various applications.

Maximum Supply Voltage (Vsup): 16 V

The maximum supply voltage of 16V allows for compatibility with a wide range of power sources, making this product suitable for diverse electronic systems.

Technical Specifications

Analog Waveform Generation MC1455D attributes and parameters. Explore more Analog Waveform Generation devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MC1455D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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