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MC1455BP1G

Onsemi

MC1455BP1G by Onsemi

MC1455BP1G by Onsemi is an Analog Waveform Generation IC with 8 terminals. It operates at a supply voltage range of 4.5V to 16V and has a temperature range of -40°C to 85°C. This rectangular package IC is ideal for pulse generation applications in industrial settings.

Median Price

$0.246

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

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$0.246

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870

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Chip Stock

USA . 34,000 parts In-Stock

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34,000

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Vyrian

USA . 8,785 parts In-Stock

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Digiode

USA . 53 parts In-Stock

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53

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Distributors (Availability)

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Corohmni

South Africa . 304 parts In-Stock

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$0.241

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304

$0.241

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Continental Prestige Electronics

USA . 5,146 parts In-Stock

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$0.246

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$0.241

5,146

$0.246

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$0.241

Argo Parts USA

USA . 454 parts In-Stock

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$0.246

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$0.239

454

$0.246

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$0.239

Ampacity Inc.

Singapore . 1,183 parts In-Stock

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$0.500

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1,183

$0.500

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AZTECH Wire

Italy . 432 parts In-Stock

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$5.007

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432

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SupplyDigital Components

Austria . 5,422 parts In-Stock

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TANS Electronics

Latvia . 5,107 parts In-Stock

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Kulean Microsystems

USA . 2,752 parts In-Stock

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Corphita

USA . 1,969 parts In-Stock

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Problanco Electronics

Mexico . 1,807 parts In-Stock

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Microchip USA

USA . 349 parts In-Stock

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349

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UHIMA Technologies

Türkiye . 239 parts In-Stock

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Kepictronics

USA . 206 parts In-Stock

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Perfect Parts

USA . 202 parts In-Stock

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Overview

Unlock the power of precise analog waveform generation with the MC1455BP1G by Onsemi. Known for their top-quality products, Onsemi delivers reliability and performance in every component they manufacture. Ideal for a wide range of applications, this rectangular package IC offers customers unmatched value and flexibility. Whether you need pulse or rectangular waveforms, the MC1455BP1G is designed to meet your needs with ease. Experience the benefits of Onsemi's innovative technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability and ease of handling.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage of 5V makes it compatible with many common power supplies and systems, enhancing its versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand challenging environmental conditions and extended usage without compromising performance.

Technology: BIPOLAR

Utilizing bipolar technology enables precise control and generation of analog waveforms, ensuring accurate and stable output signals for various applications.

Maximum Supply Voltage (Vsup): 16 V

The ability to handle a maximum supply voltage of 16V allows for flexibility in power input options, accommodating a wide range of voltage requirements for different projects.

Technical Specifications

Analog Waveform Generation MC1455BP1G attributes and parameters. Explore more Analog Waveform Generation devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

MC1455BP1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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