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MC1455P1

Texas Instruments

MC1455P1 by Texas Instruments

MC1455P1 by Texas Instruments is an Analog Waveform Generation IC with power supplies of 5/15V. It has 8 terminals, operates b/w 0-70°C, and uses bipolar technology. The package style is in-line rectangular made of plastic/epoxy, suitable for commercial temperature grade applications.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

63

In-Stock Inventory

1k+

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DF Sales Co.

USA . 40 parts In-Stock

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$0.300

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DF Sales Co.

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Ace Electronics

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TEDSS.com

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Component Electronics Inc.

Canada . 2,679 parts In-Stock

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Forefront Electronics and Design

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$4.900

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American Microsemiconductor Inc.

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LWI Electronics Inc

India . 4,855 parts In-Stock

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Lakeview Electronics

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Digiode

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Inland Empire Components Inc.

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Sunrise Surplus Inc.

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First Choice Components Inc.

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Corohmni

South Africa . 179 parts In-Stock

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$0.300

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Ampacity Inc.

Singapore . 681 parts In-Stock

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One Stop Electronics

USA . 385 parts In-Stock

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Parana Technologies

USA . 107 parts In-Stock

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$9.663

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DigiPath Technology Company

USA . 591 parts In-Stock

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$9.904

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$9.112

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Aztec Data Supply Inc.

USA . 3,701 parts In-Stock

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$9.915

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ChromeModa Solutions

Germany . 231 parts In-Stock

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$8.287

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IDEA Electronic Components Group

UK . 11 parts In-Stock

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$9.601

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$9.095

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AZTECH Wire

Italy . 308 parts In-Stock

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$19.798

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Component Stockers USA

USA . 505 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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Microchip USA

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Overview

Unlock endless possibilities with the MC1455P1 by Texas Instruments, a premium Analog Waveform Generation device that delivers unparalleled quality and performance. Manufactured by industry-leader Texas Instruments, this product offers reliable power supplies and a wide temperature range for versatile applications. Whether you're in need of precision timing or waveform shaping, the MC1455P1 provides unmatched value and benefits, making it the perfect choice for engineers and hobbyists alike. Elevate your projects with the superior capabilities of the MC1455P1 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection for the internal components, making the product durable and reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various design layouts, making it versatile for different applications.

Power Supplies (V): 5/15

Compatible with both 5V and 15V power supplies, providing flexibility in power input options.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and configurations, enabling more complex waveforms to be generated.

Package Style (Meter): IN-LINE

In-line package style makes it easy to incorporate the product into existing setups without taking up too much space.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand relatively high heat environments without malfunctioning.

Minimum Operating Temperature: 0 °C

Capable of operating at temperatures as low as 0°C, ensuring reliable performance in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish enhances conductivity and solderability, improving the overall performance of the product.

Terminal Position: DUAL

Dual terminal positions allow for more versatile connectivity options and support different circuit configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in typical environmental conditions, suitable for general commercial applications.

Technology: BIPOLAR

BIPOLAR technology offers precise control and accuracy in waveform generation, making it ideal for demanding applications that require stability and consistency.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies the assembly process and provides strong mechanical support for the terminals, enhancing reliability.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, it allows for easy and secure mounting on standard PCBs, facilitating efficient circuit integration.

Technical Specifications

Analog Waveform Generation MC1455P1 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MC1455P1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-277-0391, 5962002770391, 5962-01-137-3675, 5962011373675, 5962-01-069-3045, 5962010693045, 5962-01-158-4377, 5962011584377, 5962-01-121-4511, 5962011214511

NIIN

002770391, 011373675, 010693045, 011584377, 011214511

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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