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TLC555MD

Texas Instruments

TLC555MD by Texas Instruments

TLC555MD by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 2-15V and max output frequency of 1.2 GHz. This CMOS technology-based IC, suitable for military-grade applications, comes in a small outline package ideal for surface-mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,001 parts In-Stock

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Digiode

USA . 1,010 parts In-Stock

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One Stop Electronics

USA . 699 parts In-Stock

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$2.500

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699

$2.500

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Semicontronic

India . 782 parts In-Stock

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$4.500

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$4.388

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$4.365

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782

$4.500

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$4.365

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Parana Technologies

USA . 565 parts In-Stock

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$16.910

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$17.146

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565

$16.910

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AZTECH Wire

Italy . 875 parts In-Stock

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$17.399

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$17.399

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DigiPath Technology Company

USA . 601 parts In-Stock

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$18.620

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$17.130

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601

$18.620

$17.130

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ChromeModa Solutions

Germany . 4,821 parts In-Stock

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$19.000

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$15.580

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$19.000

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IDEA Electronic Components Group

UK . 477 parts In-Stock

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$19.000

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$18.050

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$17.100

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477

$19.000

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Corphita

USA . 1,376 parts In-Stock

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Corohmni

South Africa . 234 parts In-Stock

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Overview

Elevate your analog waveform generation with the TLC555MD from Texas Instruments. This versatile component offers unmatched quality and reliability, backed by a trusted manufacturer. Ideal for a variety of applications, this product provides exceptional value to customers seeking precise and efficient waveforms. Experience the benefits of superior performance and durability with the TLC555MD, your go-to solution for all waveform generation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides good protection for the internal components of the product.

Surface Mount: YES

Allows for easy and secure installation onto a circuit board, saving space and making it suitable for compact designs.

Maximum Output Frequency: 1.2 GHz

High frequency capability allows for generating a wide range of waveforms with precision and accuracy.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage requirement that is easily achievable in most electronic circuits.

Maximum Operating Temperature: 125 °C

Wide temperature range allows for reliable operation in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, resulting in efficient waveform generation.

Technical Specifications

Analog Waveform Generation TLC555MD attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 15 V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TLC555MD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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