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LMC555MDA

Texas Instruments

LMC555MDA by Texas Instruments

LMC555MDA by Texas Instruments is a CMOS IC for Analog Waveform Generation. It operates b/w -40 to 85 °C with Vsup ranging from 1.5V to 12V. With a max output frequency of 3 GHz, it's ideal for industrial applications requiring pulse and rectangular waveforms.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,602 parts In-Stock

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Digiode

USA . 3,112 parts In-Stock

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3,112

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Anansix

USA . 1,051 parts In-Stock

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1,051

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Distributors (Availability)

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One Stop Electronics

USA . 579 parts In-Stock

1+ parts

$6.500

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579

$6.500

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AZTECH Wire

Italy . 312 parts In-Stock

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$15.152

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312

$15.152

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Parana Technologies

USA . 1,347 parts In-Stock

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$16.498

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$16.787

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1,347

$16.498

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$16.787

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DigiPath Technology Company

USA . 1,212 parts In-Stock

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$18.166

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$16.713

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1,212

$18.166

$16.713

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ChromeModa Solutions

Germany . 4,495 parts In-Stock

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$18.537

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$15.200

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$18.537

$15.200

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IDEA Electronic Components Group

UK . 1,106 parts In-Stock

1+ parts

$18.537

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$17.610

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$16.683

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1,106

$18.537

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$16.683

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Corphita

USA . 1,474 parts In-Stock

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Microchip USA

USA . 430 parts In-Stock

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Overview

Unleash the power of precision with the LMC555MDA by Texas Instruments. As a leader in analog waveform generation technology, Texas Instruments delivers unmatched quality and reliability. This versatile surface mount chip offers a wide range of applications, from pulse to rectangular waveforms. With a nominal supply voltage of 5V and a maximum output frequency of 3GHz, the LMC555MDA provides exceptional value and performance for industrial-grade projects. Experience the benefits of cutting-edge CMOS technology and elevate your designs to new heights with the LMC555MDA.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and fast mounting onto PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common and easily accessible power source, making it convenient for integration into existing systems.

Maximum Output Frequency: 3 GHz

The high output frequency of 3 GHz allows for generating a wide range of analog waveforms with precision and accuracy.

Package Style (Meter): UNCASED CHIP

The un-cased chip package style offers flexibility in terms of integration and customization for different applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures as low as -40°C, making it suitable for a wide range of environmental conditions.

Terminal Position: UPPER

The upper terminal position simplifies the connection process and ensures proper alignment during installation.

Other IC type: PULSE; RECTANGULAR

Supports pulse and rectangular waveform generation, offering versatility in waveform options for various applications.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage of 1.5V allows for operation in low power scenarios, ideal for energy-efficient designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring robustness and reliability in harsh operating conditions.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, making it efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of soldering issues, ensuring a secure connection.

Maximum Supply Voltage (Vsup): 12 V

With a maximum supply voltage of 12V, the product can handle higher voltage inputs without damage, providing flexibility in power source options.

Technical Specifications

Analog Waveform Generation LMC555MDA attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

X-XUUC-N

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

3 GHz

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LMC555MDA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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