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LMC555CM/NOPB

Texas Instruments

LMC555CM/NOPB by Texas Instruments

LMC555CM/NOPB by Texas Instruments is a CMOS analog waveform generator with 5V supply voltage, 3 GHz output frequency, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring pulse generation in a compact rectangular package.

Median Price

$0.978

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

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Avnet

USA . 1,101 parts In-Stock

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Farnell

UK . 5,955 parts In-Stock

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Arrow

USA . 17 parts In-Stock

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$0.978

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$0.774

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$0.755

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$0.693

17

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Chip1Stop

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Newark

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Mouser Electronics

USA . 24,994 parts In-Stock

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Verical

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Digiode

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Nova Conductors

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TME

Poland . 575 parts In-Stock

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Component Electronics Inc.

Canada . 10 parts In-Stock

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Chip Stock

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Atlantic Semiconductor

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Inventory MP

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Semicontronic

India . 7,923 parts In-Stock

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$0.580

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$0.566

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$0.563

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Ampacity Inc.

Singapore . 3,840 parts In-Stock

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Corphita

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Argo Parts USA

USA . 2,580 parts In-Stock

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Advanced Electronics

New Zealand . 194 parts In-Stock

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$0.827

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Modulus Dynamics

Lithuania . 200 parts In-Stock

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$0.856

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$0.848

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$0.822

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Continental Prestige Electronics

USA . 5,955 parts In-Stock

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$0.971

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$0.651

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$0.440

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CoreStaff

Japan . 1,045 parts In-Stock

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$2.591

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$0.962

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$0.924

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Parana Technologies

USA . 744 parts In-Stock

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$15.078

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$15.493

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DigiPath Technology Company

USA . 289 parts In-Stock

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$16.603

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ChromeModa Solutions

Germany . 1,437 parts In-Stock

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$16.942

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$13.892

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IDEA Electronic Components Group

UK . 724 parts In-Stock

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$16.095

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$15.248

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Corohmni

South Africa . 276 parts In-Stock

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Microchip USA

USA . 2,126 parts In-Stock

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$47.490

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CPlus Electronics

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Perfect Parts

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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iodParts Technologies Inc.

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

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Lixinc

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GreenTree Electronics

Israel . 2,338 parts In-Stock

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Speed Components Ltd (Excess)

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Lucentia Tech

USA . 1,000 parts In-Stock

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Kepictronics

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UK . 198 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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EMSNET (Excess)

USA . 9 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the LMC555CM/NOPB, a versatile Analog Waveform Generation IC. This small outline package delivers exceptional performance with a wide operating temperature range, making it suitable for various industrial applications. With a maximum output frequency of 3 GHz and low supply current, this product offers high value and efficiency to customers seeking precision and stability in their designs. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Maximum Output Frequency: 3 GHz

High maximum output frequency ensures that the product can generate complex waveforms efficiently and accurately.

Nominal Supply Voltage (Vsup): 5 V

Standard supply voltage of 5V makes it compatible with a wide range of systems and devices.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact designs.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the product to be used in extreme environmental conditions.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with various digital systems.

Technical Specifications

Analog Waveform Generation LMC555CM/NOPB attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

3 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.753 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

.4 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

LMC555CM/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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