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SE556-1CF

NXP Semiconductors

SE556-1CF by NXP Semiconductors

SE556-1CF by NXP Semiconductors is a dual-function analog waveform generator with a max output frequency of 0.5 GHz. It operates in extreme temperatures from -55 °C to 125 °C and features a ceramic, glass-sealed package. Ideal for military applications, it supports supply voltages from 4.5V to 16V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,926 parts In-Stock

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Vyrian

USA . 2,515 parts In-Stock

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Anansix

USA . 2,303 parts In-Stock

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One Stop Electronics

USA . 160 parts In-Stock

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$5.500

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UNI Independent Distributors

Spain . 3,935 parts In-Stock

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Corphita

USA . 3,782 parts In-Stock

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Overview

Unlock unmatched performance with the SE556-1CF from NXP Semiconductors, a leader in innovative solutions. Designed for analog waveform generation, this robust and durable component excels in demanding environments, making it ideal for military and aerospace applications. Experience exceptional reliability, high output frequencies, and versatility, all while benefiting from NXP's commitment to quality and cutting-edge technology. Elevate your projects with a product that delivers superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package offers excellent protection against environmental factors, ensuring durability and reliability in demanding applications.

No. of Functions: 2

With two functions, this device provides versatility, allowing it to perform multiple tasks, which can save space and reduce system complexity.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and design, fitting easily into various electronic configurations.

Maximum Output Frequency: 0.5 GHz

A maximum output frequency of 0.5 GHz makes this device suitable for high-frequency applications, enhancing performance in communications and signal processing.

No. of Terminals: 14

With 14 terminals, this device provides ample connectivity options for integration into various circuits, increasing flexibility in design.

Package Style (Meter): IN-LINE

The in-line package style allows for easy mounting and integration into existing systems, simplifying installation processes.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that this product can perform reliably in extreme environments, making it suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

A wide operating temperature range from -55 °C allows the device to function within harsh conditions, proving its reliability in various applications.

Terminal Position: DUAL

The dual terminal position enhances ease of connection while maintaining a compact footprint, ideal for space-constrained environments.

Maximum Seated Height: 5.08 mm

A low seated height of 5.08 mm helps in maintaining low-profile designs, which is beneficial for compact electronic devices.

Width: 7.62 mm

The width of 7.62 mm is suitable for standard PCB designs, facilitating easy integration into a wide range of applications.

Other IC Type: PULSE

As a pulse type IC, it is well-suited for generating precise timing signals, making it ideal for digital communication systems.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for flexible power supply design options, benefiting low-voltage applications.

Length: 19.535 mm

The compact length of 19.535 mm aids in maintaining a small device footprint, essential for portable electronics.

Temperature Grade: MILITARY

The military temperature grade indicates high reliability and performance under extreme conditions, making this device suitable for defense applications.

Maximum Supply Current (Isup): 30 mA

With a maximum supply current of only 30 mA, this device is power-efficient, making it ideal for battery-powered applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical strength, ensuring durability in high-vibration environments.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm ensures compatibility with common PCB design practices, simplifying the integration process.

Maximum Supply Voltage (Vsup): 16 V

A maximum supply voltage of 16 V allows for compatibility with a wide range of electronic systems, enhancing the device's versatility.

Technical Specifications

Analog Waveform Generation SE556-1CF attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T14

Length:

19.535 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SE556-1CF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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