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TLC556MFK

Texas Instruments

TLC556MFK by Texas Instruments

TLC556MFK by Texas Instruments is a dual-function analog waveform generator with 1.2 GHz max output frequency, suitable for military applications. It operates b/w -55 to 125 °C, with supply voltage ranging from 2V to 15V. This CMOS technology chip carrier has 20 terminals and is surface-mountable in a square package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,496 parts In-Stock

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Digiode

USA . 347 parts In-Stock

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347

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One Stop Electronics

USA . 715 parts In-Stock

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$0.500

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715

$0.500

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Semicontronic

India . 1,083 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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1,083

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 1,440 parts In-Stock

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$5.500

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1,440

$5.500

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Parana Technologies

USA . 514 parts In-Stock

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$10.296

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$10.822

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514

$10.296

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$10.822

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DigiPath Technology Company

USA . 1,329 parts In-Stock

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$11.337

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$10.430

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1,329

$11.337

$10.430

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ChromeModa Solutions

Germany . 1,875 parts In-Stock

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$11.568

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$9.486

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1,875

$11.568

$9.486

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IDEA Electronic Components Group

UK . 518 parts In-Stock

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$11.568

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$10.990

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$10.411

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518

$11.568

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$10.411

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AZTECH Wire

Italy . 726 parts In-Stock

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$15.928

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726

$15.928

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Corphita

USA . 1,376 parts In-Stock

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Corohmni

South Africa . 249 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TLC556MFK, a versatile analog waveform generation IC. This cutting-edge product offers customers the perfect balance of performance and value, making it ideal for a wide range of applications. From pulse shaping to rectangular waveforms, this chip delivers exceptional results every time. Trust Texas Instruments to provide you with top-notch products that exceed expectations. Elevate your projects with the TLC556MFK today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent protection and durability, making this product suitable for harsh environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices, saving space and facilitating automated assembly processes.

Maximum Output Frequency: 1.2 GHz

With a high maximum output frequency of 1.2 GHz, this product is capable of generating high-frequency analog waveforms, making it ideal for applications requiring fast signal processing.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in elevated temperature environments, making this product suitable for industrial and military applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for various electronic applications.

Technical Specifications

Analog Waveform Generation TLC556MFK attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 15V NOMINAL

Other IC type:

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/18

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.89 mm

Trade Compliance

TLC556MFK Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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