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TLC555CPWG4

Texas Instruments

TLC555CPWG4 by Texas Instruments

TLC555CPWG4 by Texas Instruments is a CMOS analog waveform generator with 14 terminals, operating b/w 0-70°C. It has a supply voltage range of 2-15V and can output up to 1.2 GHz frequency. Ideal for pulse generation in commercial applications due to its small outline package and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,376 parts In-Stock

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Digiode

USA . 4,820 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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One Stop Electronics

USA . 389 parts In-Stock

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$0.500

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389

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Parana Technologies

USA . 1,665 parts In-Stock

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$1.313

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$2.057

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$1.313

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ChromeModa Solutions

Germany . 3,298 parts In-Stock

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$1.475

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$1.210

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3,298

$1.475

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IDEA Electronic Components Group

UK . 1,970 parts In-Stock

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$1.475

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$1.328

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$1.475

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Ampacity Inc.

Singapore . 895 parts In-Stock

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$4.500

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895

$4.500

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Corohmni

South Africa . 1,244 parts In-Stock

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$10.783

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AZTECH Wire

Italy . 725 parts In-Stock

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$17.917

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Continental Prestige Electronics

USA . 6,793 parts In-Stock

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DigiPath Technology Company

USA . 1,779 parts In-Stock

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$1.330

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Corphita

USA . 1,521 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 217 parts In-Stock

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Overview

Unlock endless possibilities with the TLC555CPWG4 by Texas Instruments, a leading manufacturer known for superior quality and innovation. As part of the Analog Waveform Generation category, this product offers unmatched value and benefits for a wide range of applications. Whether you're looking to enhance your circuit design or improve signal processing, the TLC555CPWG4 provides reliable performance and precision. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the TLC555CPWG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Maximum Output Frequency: 1.2 GHz

High frequency output capability, ideal for generating complex waveforms.

Nominal Supply Voltage (Vsup): 5 V

Stable supply voltage for consistent performance.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for versatility in different environments.

Technology: CMOS

Utilizes CMOS technology for efficient and reliable operation.

Technical Specifications

Analog Waveform Generation TLC555CPWG4 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 2 V OR 15 V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

TLC555CPWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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