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TS555MPT

STMicroelectronics

TS555MPT by STMicroelectronics

TS555MPT by STMicroelectronics is a CMOS analog waveform generator with a max output frequency of 2 GHz and operates b/w 2-16 V. It features an operating temp range from -55 °C to 125 °C, making it ideal for military applications. Its compact SOIC-8 package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,954 parts In-Stock

1+ parts

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2,954

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Anansix

USA . 2,838 parts In-Stock

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2,838

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Vyrian

USA . 1,961 parts In-Stock

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1,961

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$3.218

100+ parts

-

1k+ parts

$2.896

10k+ parts

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1,278

$3.218

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$2.896

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MKK Technologies

India . 1,506 parts In-Stock

1+ parts

$6.052

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1,506

$6.052

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DigiPath Technology Company

USA . 1,506 parts In-Stock

1+ parts

$6.052

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1,506

$6.052

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Parana Technologies

USA . 1,844 parts In-Stock

1+ parts

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$3.848

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1,844

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$3.848

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Corphita

USA . 498 parts In-Stock

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498

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Overview

Elevate your projects with the TS555MPT from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile analog waveform generator excels in demanding applications, delivering reliable performance even in extreme conditions. With its compact design and impressive frequency capabilities, it ensures seamless integration into your systems, enhancing efficiency and driving innovation. Trust in STMicroelectronics for unmatched quality and technological superiority!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of robust plastic/epoxy materials ensures durability and reliability in various environments.

Surface Mount: YES

Surface mounting enables easier integration into compact circuit designs and improves space efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for optimized board layout and reduces overall PCB size.

Nominal Supply Voltage (Vsup): 3 V

Operating at a low nominal supply voltage enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Output Frequency: 2 GHz

A high output frequency capability ensures excellent performance in high-speed applications and signal generation.

Power Supplies (V): 2/12

Flexible power supply options improve compatibility with a variety of systems and applications.

No. of Terminals: 8

An 8-terminal configuration allows for a compact design while providing necessary I/O connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile promote a low PCB footprint, suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -55 °C

Wide temperature range makes it viable for use in extreme conditions, meeting military and aerospace standards.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing and layout for PCB designers.

Maximum Seated Height: 1.2 mm

Low seated height aids in compact design and increases design flexibility in various applications.

Width: 3 mm

Narrow width is ideal for space-sensitive applications, minimizing space on the PCB.

Other IC type: PULSE; RECTANGULAR

Supports pulse and rectangular waveform generation, expanding its application range in signal processing.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage enhances versatility, enabling operation in more applications.

Length: 4.4 mm

Compact length allows for high-density solutions in modern electronic designs.

Temperature Grade: MILITARY

Military-grade temperature tolerance guarantees performance under high reliability standards.

Technology: CMOS

CMOS technology provides low power consumption, making the product suitable for portable and power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals simplify PCB assembly and help provide robust electrical connections.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for denser layouts and more efficient use of space on PCBs.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage accommodates a wide range of circuit designs and power requirements.

Technical Specifications

Analog Waveform Generation TS555MPT attributes and parameters. Explore more Analog Waveform Generation devices from STMicroelectronics

Specs

Additional Features:

IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

TS555MPT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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