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TS555IDTR

STMicroelectronics

TS555IDTR by STMicroelectronics

TS555IDTR from STMicroelectronics is a CMOS timer ideal for automotive applications, operating b/w -40 °C to 125 °C. It supports a nominal voltage of 3V and achieves output frequencies up to 2GHz. This compact 8-terminal device features a small outline design for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,642 parts In-Stock

1+ parts

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4,642

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Vyrian

USA . 2,974 parts In-Stock

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2,974

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Anansix

USA . 2,148 parts In-Stock

1+ parts

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2,148

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Bristol Electronics

USA . 1,545 parts In-Stock

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1,545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,204 parts In-Stock

1+ parts

$15.395

100+ parts

-

1k+ parts

$13.856

10k+ parts

-

1,204

$15.395

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$13.856

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MKK Technologies

India . 1,835 parts In-Stock

1+ parts

$28.950

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1,835

$28.950

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DigiPath Technology Company

USA . 1,835 parts In-Stock

1+ parts

$28.950

100+ parts

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1,835

$28.950

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Corphita

USA . 2,492 parts In-Stock

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2,492

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Parana Technologies

USA . 1,371 parts In-Stock

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$18.407

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1,371

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$18.407

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Overview

Unlock unparalleled performance with the TS555IDTR from STMicroelectronics, a leader in analog waveform generation. This versatile timer IC delivers exceptional reliability across diverse applications, from automotive to consumer electronics. Its compact design and broad operating temperature range ensure efficient operation in any environment, while its low power consumption maximizes energy savings. Choose the TS555IDTR for quality you can trust and performance that sets your designs apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient manufacturing and space-saving designs on printed circuit boards.

Package Shape: RECTANGULAR

A rectangular package shape facilitates easy integration into compact electronic systems.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V enhances battery longevity in portable applications.

Maximum Output Frequency: 2 GHz

The capability to produce output frequencies up to 2 GHz enables the generation of high-frequency signals needed in advanced communication systems.

No. of Terminals: 8

With 8 terminals, this product offers sufficient connectivity for various configurations while maintaining a compact size.

Package Style (Meter): SMALL OUTLINE

The small outline package style is favorable for modern electronics where space is a premium.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in demanding automotive environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme cold environments, enhancing its versatility.

Terminal Position: DUAL

Dual terminal positioning improves the layout and reduces the complexity of PCB designs.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows for low-profile applications without compromising performance.

Width: 3.9 mm

A width of 3.9 mm makes it ideal for integration into tight spaces, particularly in consumer electronics.

Other IC type: TIMER

This integrated circuit configuration enables precise timing applications, expanding its usability in various circuits.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate down to 2V makes it flexible for applications with varying power supply specifications.

Length: 4.9 mm

A compact length of 4.9 mm supports the miniaturization trend in electronic design.

Temperature Grade: AUTOMOTIVE

Being rated for automotive use implies robustness and reliability across a range of operating conditions.

Maximum Supply Current (Isup): 0.4 mA

A low maximum supply current of 0.4 mA contributes to energy efficiency, ideal for battery-operated devices.

Technology: CMOS

CMOS technology enables low power consumption while ensuring high performance, making it suitable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of handling during assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with a wide range of PCB layouts and designs.

Maximum Supply Voltage (Vsup): 16 V

Operating at a maximum supply voltage of 16 V allows for greater flexibility in power supply options for the end user.

Technical Specifications

Analog Waveform Generation TS555IDTR attributes and parameters. Explore more Analog Waveform Generation devices from STMicroelectronics

Specs

Additional Features:

Also has 2.7MHz Output Frequency at 5V and 12V Nominal supply values

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.4 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TS555IDTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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