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SA556DR

Texas Instruments

SA556DR by Texas Instruments

SA556DR by Texas Instruments is a 14-terminal analog waveform generator with supply voltage range of 4.5V to 16V. Operating temperature from -40°C to 85°C, it's ideal for industrial applications requiring bipolar technology and pulse/rectangular waveforms in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,248 parts In-Stock

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Digiode

USA . 1,079 parts In-Stock

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1,079

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Distributors (Availability)

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One Stop Electronics

USA . 739 parts In-Stock

1+ parts

$0.500

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739

$0.500

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Ampacity Inc.

Singapore . 512 parts In-Stock

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$2.500

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512

$2.500

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Parana Technologies

USA . 498 parts In-Stock

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$4.749

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$5.251

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498

$4.749

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$5.251

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DigiPath Technology Company

USA . 1,396 parts In-Stock

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$5.229

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$4.811

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1,396

$5.229

$4.811

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IDEA Electronic Components Group

UK . 2,235 parts In-Stock

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$5.336

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$4.802

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$5.336

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$4.802

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ChromeModa Solutions

Germany . 481 parts In-Stock

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$5.336

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$4.376

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481

$5.336

$4.376

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AZTECH Wire

Italy . 667 parts In-Stock

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$5.602

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Semicontronic

India . 1,305 parts In-Stock

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$6.500

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$6.338

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$6.305

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1,305

$6.500

$6.338

$6.305

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$8.114

100+ parts

$7.384

1k+ parts

$6.653

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2,000

$8.114

$7.384

$6.653

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A-Z Elektronik GmbH

Germany . 7,337 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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Corohmni

South Africa . 489 parts In-Stock

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Corphita

USA . 365 parts In-Stock

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365

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Overview

Elevate your analog waveform generation capabilities with the Texas Instruments SA556DR. Crafted with precision and quality by a renowned manufacturer, this versatile component is designed to meet the demands of various applications in the electronics industry. From pulse shaping to rectangular wave generation, this product offers exceptional value, benefits, and advantages that will enhance your projects. Trust in Texas Instruments to deliver reliable performance and innovative solutions for all your waveform generation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount packaging makes the product easy to install on circuit boards, saving space and allowing for efficient assembly.

Nominal Supply Voltage (Vsup): 5 V

Offers a stable and standard supply voltage, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

Can operate in relatively high temperature environments, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperature conditions ensures usability in various environments, including outdoor or refrigerated settings.

Technology: BIPOLAR

Bipolar technology offers precise and stable waveform generation, making it ideal for applications requiring accurate signal outputs.

Technical Specifications

Analog Waveform Generation SA556DR attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5/16

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

SA556DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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