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SA556-1F

NXP Semiconductors

SA556-1F by NXP Semiconductors

SA556-1F by NXP Semiconductors is a dual-function analog waveform generator with a max output frequency of 0.5 GHz. It operates in industrial conditions, supporting -40 °C to 85 °C and requires a supply voltage b/w 4.5V and 16V. Ideal for pulse applications, it features a ceramic, glass-sealed package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,832 parts In-Stock

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Digiode

USA . 1,490 parts In-Stock

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1,490

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Anansix

USA . 1,257 parts In-Stock

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1,257

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,033 parts In-Stock

1+ parts

$3.500

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1,033

$3.500

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UNI Independent Distributors

Spain . 6,242 parts In-Stock

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Corphita

USA . 4,600 parts In-Stock

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4,600

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Overview

Unlock unparalleled performance with the SA556-1F from NXP Semiconductors, a leader in innovative analog solutions. Designed for maximum reliability across diverse applications, this dual-function waveform generator delivers exceptional frequency output up to 0.5 GHz, ensuring precision in every project. With robust temperature resilience and a compact design, it seamlessly integrates into industrial environments, providing significant value and enhancing your operational efficiency. Experience quality you can trust!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The durable ceramic and glass-sealed construction provides protection against environmental factors, ensuring reliability in challenging industrial applications.

No. of Functions: 2

With two functions integrated into one device, this product optimizes space and reduces the need for multiple components in design.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and maximizing board real estate while supporting versatile mounting options.

Maximum Output Frequency: 0.5 GHz

The high output frequency enhances performance in applications requiring fast signal processing and high-speed waveform generation.

No. of Terminals: 14

Fourteen terminals allow for flexible connections and configurations, making integration into various systems straightforward.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and is suitable for space-constrained designs.

Maximum Operating Temperature: 85 °C

This wide operating temperature range ensures reliable performance in both hot and demanding environments typical in industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at very low temperatures makes this device suitable for use in extreme conditions without a compromise in performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout, accommodating various design requirements while ensuring robust connections.

Maximum Seated Height: 5.08 mm

A low seated height optimizes the device for low-profile applications, ensuring compatibility with compact designs.

Width: 7.62 mm

The compact width makes it ideal for densely populated PCB layouts where space is a premium.

Other IC Type: PULSE

Being a pulse IC type allows for precise signal generation, which is essential in pulse modulation applications.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum supply voltage enhances compatibility with a wider range of power supply options and energy-efficient designs.

Length: 19.535 mm

The specified length allows for effective integration into various form factors, maintaining the device's performance across applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring robustness and reliability even in harsh operating conditions.

Maximum Supply Current (Isup): 30 mA

An optimized maximum supply current enhances energy efficiency while providing sufficient power for high-performance applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures strong mechanical stability and reliability, making it suitable for various mounting scenarios.

Terminal Pitch: 2.54 mm

A standard terminal pitch allows for easy integration and compatibility with common PCB layouts and components.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage expands the range of applications, allowing for use in systems with higher power requirements.

Technical Specifications

Analog Waveform Generation SA556-1F attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T14

Length:

19.535 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SA556-1F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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