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ICM7555ID/01,112

NXP Semiconductors

ICM7555ID/01,112 by NXP Semiconductors

The NXP Semiconductors ICM7555ID/01,112 is an Analog Waveform Generation IC with a supply voltage range of 3-16V. It operates in industrial temperature range (-40 to 85°C) and has a max output frequency of 0.5 GHz. This CMOS technology-based IC is suitable for pulse applications in various electronic circuits.

Median Price

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Vyrian

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Nova Conductors

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PC Components Company LLC

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Sensible Micro Corp

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Ampacity Inc.

Singapore . 766 parts In-Stock

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One Stop Electronics

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Advanced Electronics

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Aztec Data Supply Inc.

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Corohmni

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AZTECH Wire

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Component Stockers USA

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Microchip USA

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Overview

Unleash the power of analog waveform generation with the ICM7555ID/01,112 by NXP Semiconductors. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Perfect for a wide range of applications, this small outline package delivers exceptional performance under industrial temperatures. With a nominal supply voltage of 5V and a maximum output frequency of 0.5 GHz, the ICM7555ID/01,112 provides customers with unmatched value and benefits. Experience the advantages of NXP Semiconductors' cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and applications.

Maximum Output Frequency: 0.5 GHz

Capable of producing high-frequency waveforms up to 0.5 GHz, making it suitable for applications requiring fast signal generation.

Power Supplies (V): 5/15

Supports both 5V and 15V power supplies, providing flexibility for different operating conditions and requirements.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures up to 85°C, suitable for industrial environments or applications with high heat levels.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperatures down to -40°C, making it suitable for a wide range of environmental conditions.

Technology: CMOS

Utilizes CMOS technology, offering low power consumption and high noise immunity for efficient and reliable operation.

Technical Specifications

Analog Waveform Generation ICM7555ID/01,112 attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

ICM7555ID/01,112 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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