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SA556J

Texas Instruments

SA556J by Texas Instruments

SA556J by Texas Instruments is a dual-function analog waveform generator with 14 terminals. It operates b/w -40 to 85°C, with supply voltage ranging from 4.5V to 16V. This rectangular package IC is ideal for industrial applications requiring bipolar technology and precise pulse generation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,343 parts In-Stock

1+ parts

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5,343

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Vyrian

USA . 3,246 parts In-Stock

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3,246

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Anansix

USA . 2,135 parts In-Stock

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2,135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ChromeModa Solutions

Germany . 5,165 parts In-Stock

1+ parts

$1.308

100+ parts

$1.073

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5,165

$1.308

$1.073

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One Stop Electronics

USA . 1,287 parts In-Stock

1+ parts

$3.500

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1,287

$3.500

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AZTECH Wire

Italy . 658 parts In-Stock

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$10.283

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658

$10.283

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IDEA Electronic Components Group

UK . 3,947 parts In-Stock

1+ parts

$11.586

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$10.428

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3,947

$11.586

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$10.428

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DigiPath Technology Company

USA . 3,290 parts In-Stock

1+ parts

$21.788

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3,290

$21.788

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MKK Technologies

India . 1,444 parts In-Stock

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$21.788

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1,444

$21.788

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Corphita

USA . 6,565 parts In-Stock

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6,565

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Parana Technologies

USA . 2,414 parts In-Stock

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$13.853

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2,414

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$13.853

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Overview

Elevate your analog waveform generation capabilities with the SA556J by Texas Instruments. Crafted with precision and expertise, this versatile device offers unmatched quality and performance. Whether you're designing audio equipment, precision timing circuits, or pulse generation systems, the SA556J delivers reliable and consistent results. Gain a competitive edge with its efficient design, wide operating temperature range, and ease of integration. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations. Elevate your projects with the SA556J today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides good protection against environmental factors and ensures long-term durability.

No. of Functions: 2

Having multiple functions in one device saves space and reduces the complexity of the overall system.

Nominal Supply Voltage (Vsup): 5V

Ideal voltage for many applications, ensuring compatibility and stable performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Technology: BIPOLAR

Bipolar technology offers high switching speed and precise control, making it suitable for waveform generation.

Technical Specifications

Analog Waveform Generation SA556J attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5/16

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

SA556J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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