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MAX6369KA/V+

Analog Devices

MAX6369KA/V+ by Analog Devices

MAX6369KA/V+ by Analog Devices is an 8-terminal BICMOS technology IC with power supplies of 3/5V. It operates in industrial temperature range (-40 to 85 °C) and has a peak reflow temperature of 260°C. This analog waveform generator, suitable for AEC-Q100 applications, comes in a small outline package with gull wing terminals.

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6

In-Stock Inventory

1k+

MAX6369KA/V+ by Analog Devices
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Analog Devices Inc

USA . 1,246 parts In-Stock

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Chip Stock

USA . 29,257 parts In-Stock

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Digiode

USA . 2,725 parts In-Stock

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Anansix

USA . 2,448 parts In-Stock

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Vyrian

USA . 2,217 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 56 parts In-Stock

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MARBEL Systems

Belgium . 67 parts In-Stock

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$2.840

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CoreStaff

Japan . 56 parts In-Stock

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$2.937

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$2.750

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$2.731

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Texas Native Microelectronics

USA . 90 parts In-Stock

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$3.264

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$3.133

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$3.036

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$2.872

90

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Kenton Components

USA . 4,290 parts In-Stock

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$3.917

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$3.447

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Semicontronic

India . 936 parts In-Stock

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$4.500

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$4.388

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$4.365

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Component Stockers USA

USA . 604 parts In-Stock

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$5.290

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$5.020

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$6.070

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604

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Qasali Group International

UK . 2,868 parts In-Stock

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$8.813

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$8.196

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$7.755

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QUARKTWIN TECHNOLOGY LTD

USA . 22,409 parts In-Stock

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Microchip USA

USA . 4,782 parts In-Stock

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Vigor

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Corphita

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Elevate your analog waveform generation with the MAX6369KA/V+ by Analog Devices. Manufactured with top-notch quality and AEC-Q100 screening level, this product offers unmatched reliability and precision. Ideal for a wide range of applications, this small outline, thin profile device provides a seamless integration into your projects. With a temperature grade of industrial and nickel gold palladium terminal finish, customers can trust in its durability and performance. Experience the value and benefits this product brings to your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product resistant to damage and ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures that the product meets automotive industry standards for reliability and performance, making it suitable for use in automotive applications.

Package Shape: RECTANGULAR

Optimizes space utilization on the circuit board, allowing for more efficient placement of components.

Power Supplies (V): 3/5

Provides flexibility in voltage options, making the product suitable for a variety of applications with different power requirements.

No. of Terminals: 8

Allows for multiple connections to other components or circuitry, enhancing the versatility of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Reduces the overall size of the component, making it suitable for compact designs and applications where space is limited.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Allows the product to operate in low-temperature conditions, increasing its versatility for use in a wide range of environments.

Terminal Finish: NICKEL GOLD PALLADIUM

Provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Allows for multiple connection options and flexibility in circuit design, enhancing the functionality of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures precise and controlled heating during soldering, preventing damage to the component and maintaining its performance.

Peak Reflow Temperature °C: 260

Allows for high-temperature soldering processes, ensuring strong and reliable connections during assembly.

Temperature Grade: INDUSTRIAL

Indicates that the product is designed to withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Terminal Form: GULL WING

Facilitates easy installation and removal of the component, simplifying maintenance and servicing processes.

Terminal Pitch: 0.635 mm

Allows for precise and secure connections on the circuit board, ensuring proper functionality of the product.

Technical Specifications

Analog Waveform Generation MAX6369KA/V+ attributes and parameters. Explore more Analog Waveform Generation devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MAX6369KA/V+ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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