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ICM7555ID,623

NXP Semiconductors

ICM7555ID,623 by NXP Semiconductors

NXP Semiconductors' ICM7555ID,623 is an Analog Waveform Generation IC with 8 terminals and a supply voltage range of 3-16V. It operates in industrial temperature grades (-40 to 85°C) and has a max output frequency of 0.5 GHz. This CMOS technology-based IC is commonly used for pulse applications due to its small outline package shape and gull wing terminal form.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,074 parts In-Stock

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Digiode

USA . 3,429 parts In-Stock

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Anansix

USA . 1,946 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Corohmni

South Africa . 165 parts In-Stock

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$3.324

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One Stop Electronics

USA . 979 parts In-Stock

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Ampacity Inc.

Singapore . 906 parts In-Stock

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AZTECH Wire

Italy . 398 parts In-Stock

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Aztec Data Supply Inc.

USA . 763 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Microchip USA

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UNI Independent Distributors

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Argo Parts USA

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Corphita

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Aranea Global

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Overview

Discover the power of precision and reliability with the ICM7555ID,623 by NXP Semiconductors. As a leader in analog waveform generation technology, NXP Semiconductors delivers top-of-the-line products that are versatile and efficient. Whether you're designing pulse circuits or other applications in need of accurate timing, this small outline package offers unmatched performance. With a wide operating temperature range and compact design, the ICM7555ID,623 provides value and convenience for all your electronic needs. Experience the difference with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for portable applications.

Surface Mount: YES

This product is easy to install and requires minimal PCB space, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization on the PCB, maximizing design flexibility.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage ensures compatibility with a wide range of systems and provides stable operation.

Maximum Output Frequency: 0.5 GHz

With a high maximum output frequency of 0.5 GHz, this product is suitable for demanding applications requiring fast waveform generation.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for interfacing with other components, increasing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for efficient heat dissipation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for use in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position design allows for easy and secure connections, minimizing the risk of signal interruptions.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a low-profile design, ideal for applications with limited space.

Width (mm): 3.9 mm

The small width of 3.9mm enables compact and space-saving PCB layouts.

Other IC type: PULSE

The pulse IC type provides precise control over waveform generation, making this product suitable for applications requiring accurate signal timing.

Minimum Supply Voltage (Vsup): 3 V

With a low minimum supply voltage of 3V, this product is energy-efficient and suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 40

The generous reflow time of 40 seconds allows for reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and durable solder joints.

Length: 4.9 mm

The compact length of 4.9mm enables flexible placement on the PCB, optimizing layout options.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in demanding industrial environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, ideal for sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, ensuring robust electrical connections.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27mm allows for high-density mounting, suitable for applications requiring multiple connections in a confined space.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage of 16V provides flexibility and compatibility with a wide range of power sources.

Technical Specifications

Analog Waveform Generation ICM7555ID,623 attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

ICM7555ID,623 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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