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M38510/10902BCX

Texas Instruments

M38510/10902BCX by Texas Instruments

M38510/10902BCX by Texas Instruments is an Analog Waveform Generation IC with 2 functions, MIL-M-38510 Class B screening level, and a supply voltage range of 5V to 15V. It has a temperature range from -55°C to 125°C and is ideal for military-grade applications requiring square, pulse, or rectangular waveforms in a compact IN-LINE package.

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 9,767 parts In-Stock

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Digiode

USA . 6,263 parts In-Stock

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Anansix

USA . 1,970 parts In-Stock

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QIE Inc.

USA . 5 parts In-Stock

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Electronic Expediters

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One Stop Electronics

USA . 2,631 parts In-Stock

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$4.500

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Parana Technologies

USA . 1,207 parts In-Stock

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$7.301

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DigiPath Technology Company

USA . 1,302 parts In-Stock

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$7.223

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$6.645

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ChromeModa Solutions

Germany . 1,284 parts In-Stock

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$7.370

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$6.043

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IDEA Electronic Components Group

UK . 1,084 parts In-Stock

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$6.633

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AZTECH Wire

Italy . 55 parts In-Stock

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Corphita

USA . 5,615 parts In-Stock

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UNI Independent Distributors

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Overview

Looking for top-notch analog waveform generation? Look no further than the M38510/10902BCX by Texas Instruments. With a MILITARY-grade temperature grade and MIL-M-38510 Class B screening level, this product ensures reliability and quality. Perfect for applications requiring precise waveforms, this IC offers 2 functions in a compact package with a nominal supply voltage of 5V. Trust Texas Instruments to deliver exceptional performance and value with the M38510/10902BCX. Elevate your projects with this high-quality component!

Feature Benefit Bullets

No. of Functions: 2

Having 2 functions allows for versatile waveform generation capabilities, making this product suitable for a range of applications.

Screening Level: MIL-M-38510 Class B

Meeting MIL-M-38510 Class B screening standards ensures high reliability and quality, making this product suitable for critical military and aerospace applications.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes integration into existing systems easier and more convenient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and operate reliably in extreme temperatures.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures this product can perform reliably even in cold environments.

Other IC type: SQUARE; PULSE; RECTANGULAR

Offering multiple IC types such as square, pulse, and rectangular waveforms provides flexibility and customization options for different waveform generation needs.

Maximum Supply Current (Isup): 30 mA

With a maximum supply current of 30 mA, this product is energy-efficient and can help in reducing overall power consumption in the system.

Maximum Supply Voltage (Vsup): 15 V

The wide input voltage range of 5V to 15V allows for compatibility with various power sources and ensures reliable operation even in systems with varying supply voltages.

Technical Specifications

Analog Waveform Generation M38510/10902BCX attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

M38510/10902BCX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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