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TLC551CDBLE

Texas Instruments

TLC551CDBLE by Texas Instruments

TLC551CDBLE by Texas Instruments is an Analog Waveform Generation IC with a 1.2 GHz max output freq, operating at 0-70°C temp range. It has 8 terminals, supports supply voltage of 1-15V, and comes in a small outline package ideal for pulse generation applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,507 parts In-Stock

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3,507

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Digiode

USA . 1,326 parts In-Stock

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1,326

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Distributors (Availability)

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One Stop Electronics

USA . 297 parts In-Stock

1+ parts

$1.500

100+ parts

-

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297

$1.500

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Ampacity Inc.

Singapore . 914 parts In-Stock

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$4.500

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914

$4.500

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Semicontronic

India . 882 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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882

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 839 parts In-Stock

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$13.413

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839

$13.413

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Parana Technologies

USA . 687 parts In-Stock

1+ parts

$20.510

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$20.578

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687

$20.510

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$20.578

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ChromeModa Solutions

Germany . 2,070 parts In-Stock

1+ parts

$23.045

100+ parts

$18.897

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2,070

$23.045

$18.897

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$23.045

100+ parts

$21.893

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$20.740

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1,185

$23.045

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$20.740

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Corphita

USA . 4,146 parts In-Stock

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4,146

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DigiPath Technology Company

USA . 2,174 parts In-Stock

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$20.777

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2,174

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$20.777

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Corohmni

South Africa . 388 parts In-Stock

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388

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Overview

Experience the superior quality and precision of Texas Instruments with the TLC551CDBLE, a versatile Analog Waveform Generation IC. Whether you're designing audio equipment, test instruments, or communication systems, this product offers unbeatable value with its wide range of applications and reliable performance. Trust in Texas Instruments for cutting-edge technology and innovative solutions that will take your projects to the next level. Upgrade your designs with the TLC551CDBLE today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and ability to withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easier assembly and smaller footprint, making this product suitable for applications where space is limited.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard voltage which makes it compatible with many power sources and devices.

Maximum Output Frequency: 1.2 GHz

Capable of generating high-frequency waveforms, making it suitable for applications requiring fast signal processing.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, making it ideal for applications where space is a constraint.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Analog Waveform Generation TLC551CDBLE attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

5.3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1/15

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TLC551CDBLE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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