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SE556JB

Texas Instruments

SE556JB by Texas Instruments

SE556JB by Texas Instruments is a 14-terminal IC with supply voltage of 5V, suitable for military-grade applications. With a max operating temperature of 125°C, it offers waveform generation using bipolar technology and supports power supplies of 5/15V. The package style is in-line rectangular shape made of ceramic and glass-sealed material.

Median Price

$12.006

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Chip1Stop

Japan . 29 parts In-Stock

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$12.006

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$10.931

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Arrow

USA . 31 parts In-Stock

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$13.177

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Avnet

USA . 31 parts In-Stock

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$9.552

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$8.976

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$9.552

$8.976

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Freelance Electronics

USA . 3 parts In-Stock

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$9.184

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Digiode

USA . 2,859 parts In-Stock

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$11.406

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TME

Poland . 12 parts In-Stock

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$17.952

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Vyrian

USA . 6,171 parts In-Stock

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Semi Source

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Manoshevitz Elec. Sales

Israel . 25 parts In-Stock

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Electronic Expediters

USA . 17 parts In-Stock

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PC Components Company LLC

USA . 15 parts In-Stock

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Inland Empire Components Inc.

USA . 15 parts In-Stock

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Bristol Electronics

USA . 14 parts In-Stock

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LWI Electronics Inc

India . 12 parts In-Stock

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Goldney Electronics S.L.

Spain . 6 parts In-Stock

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Sogenti Electronics

Canada . 5 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Component Sense

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Speed Components Ltd

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Dark Horse Electronics

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Distributors (Availability)

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Parana Technologies

USA . 2,002 parts In-Stock

1+ parts

$1.375

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$127.694

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$1.238

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2,002

$1.375

$127.694

$1.238

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DigiPath Technology Company

USA . 1,979 parts In-Stock

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$1.514

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$1.514

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ChromeModa Solutions

Germany . 1,697 parts In-Stock

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$1.545

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$1.267

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$1.545

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IDEA Electronic Components Group

UK . 411 parts In-Stock

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$1.545

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$1.390

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411

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Corphita

USA . 4,457 parts In-Stock

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$10.805

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AZTECH Wire

Italy . 329 parts In-Stock

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$16.270

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Microchip USA

USA . 8,316 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kepictronics

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A-Plus Industry Inc.

USA . 8 parts In-Stock

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Overview

Unlock endless creative possibilities with the SE556JB by Texas Instruments, a high-quality Analog Waveform Generation IC that offers unparalleled precision and reliability. Manufactured by industry leader Texas Instruments, this versatile product is perfect for a wide range of applications. Whether you're a seasoned professional or a hobbyist, the SE556JB delivers exceptional value with its advanced features and cutting-edge technology. Elevate your projects with the SE556JB and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package provides excellent protection for the internal components, ensuring durability and reliability in various environmental conditions.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V allows for compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments without compromising performance.

Technology: BIPOLAR

Utilizing bipolar technology enables precise and accurate waveform generation, making it suitable for applications that require stable and reliable waveforms.

Maximum Supply Current (Isup): 24 mA

The maximum supply current of 24 mA ensures efficient power consumption, making it an energy-efficient choice for various projects.

Technical Specifications

Analog Waveform Generation SE556JB attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.94 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

24 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SE556JB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-068-9585, 5962010689585

NIIN

010689585

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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