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SE555FKB

Texas Instruments

SE555FKB by Texas Instruments

SE555FKB by Texas Instruments is a 20-terminal chip carrier with a supply voltage range of 4.5V to 18V, making it ideal for military-grade applications. With a max operating temperature of 125°C and power supplies of 5/15V, it offers precise analog waveform generation capabilities in various electronic systems. The package body material is ceramic and metal-sealed cofired, ensuring durability in harsh environments.

Median Price

$21.090

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$21.090

1k+ parts

-

10k+ parts

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55

-

$21.090

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$15.490

100+ parts

-

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300

$15.490

-

-

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Vyrian

USA . 6,727 parts In-Stock

1+ parts

-

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6,727

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Digiode

USA . 418 parts In-Stock

1+ parts

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-

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418

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$6.452

100+ parts

-

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524

$6.452

-

-

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Continental Prestige Electronics

USA . 4,206 parts In-Stock

1+ parts

$15.490

100+ parts

-

1k+ parts

-

10k+ parts

$15.180

4,206

$15.490

-

-

$15.180

Corohmni

South Africa . 17 parts In-Stock

1+ parts

$15.490

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-

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17

$15.490

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Parana Technologies

USA . 826 parts In-Stock

1+ parts

$15.629

100+ parts

-

1k+ parts

$15.998

10k+ parts

-

826

$15.629

-

$15.998

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DigiPath Technology Company

USA . 2,348 parts In-Stock

1+ parts

$17.210

100+ parts

-

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2,348

$17.210

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ChromeModa Solutions

Germany . 5,294 parts In-Stock

1+ parts

$17.561

100+ parts

$14.400

1k+ parts

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5,294

$17.561

$14.400

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IDEA Electronic Components Group

UK . 1,635 parts In-Stock

1+ parts

$17.561

100+ parts

$16.683

1k+ parts

$15.805

10k+ parts

-

1,635

$17.561

$16.683

$15.805

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Semicontronic

India . 55 parts In-Stock

1+ parts

$17.930

100+ parts

$17.482

1k+ parts

$17.392

10k+ parts

-

55

$17.930

$17.482

$17.392

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Ampacity Inc.

Singapore . 9 parts In-Stock

1+ parts

$17.930

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9

$17.930

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Lixinc

USA . 11,547 parts In-Stock

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11,547

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Microchip USA

USA . 2,928 parts In-Stock

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2,928

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Corphita

USA . 2,148 parts In-Stock

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2,148

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$15.180

1k+ parts

$14.715

10k+ parts

$14.406

2,000

-

$15.180

$14.715

$14.406

Argo Parts USA

USA . 1,977 parts In-Stock

1+ parts

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1,977

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Perfect Parts

USA . 10 parts In-Stock

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10

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Overview

Elevate your analog waveform generation capabilities with the SE555FKB by Texas Instruments. Crafted with precision and quality in mind, this product offers unparalleled performance and reliability for a wide range of applications. Whether you're a professional in the field or an enthusiast looking to take your projects to the next level, the SE555FKB delivers value, benefits, and advantages that are unmatched in its category. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides high reliability and durability, making it suitable for rugged environments.

Surface Mount: YES

Allows for easy PCB assembly and space-saving design.

Screening Level: 38535Q/M;38534H;883B

Meets stringent military standards for quality and performance.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard power sources, ensuring easy integration.

Power Supplies (V): 5/15

Offers flexibility in voltage requirements for different applications.

No. of Terminals: 20

Provides sufficient connectivity options for diverse circuit configurations.

Package Style (Meter): CHIP CARRIER

Enhances thermal performance and allows for efficient heat dissipation.

Maximum Operating Temperature: 125 °C

Suitable for extended operation in high-temperature environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely cold conditions without performance degradation.

Terminal Finish: TIN LEAD

Ensures reliable electrical connections and prevents corrosion.

Terminal Position: QUAD

Facilitates easy soldering and PCB mounting.

Width (mm): 8.89 mm

Compact size enables space-efficient placement on the circuit board.

Other IC type: PULSE; RECTANGULAR

Supports various waveform generation requirements, expanding versatility.

Minimum Supply Voltage (Vsup): 4.5 V

Allows for operation with lower voltage sources, conserving power.

Length: 8.89 mm

Uniform dimensions promote ease of PCB layout and design.

Temperature Grade: MILITARY

Meets stringent military standards for temperature range and performance.

Maximum Supply Current (Isup): 12 mA

Supports low power consumption, ideal for battery-operated devices.

Technology: BIPOLAR

Delivers precise and stable waveform generation with high accuracy.

Terminal Form: NO LEAD

Eliminates concerns of lead contamination and ensures environmental friendliness.

Terminal Pitch: 1.27 mm

Facilitates easy soldering and minimizes risks of short circuits.

Maximum Supply Voltage (Vsup): 18 V

Capable of handling higher voltage inputs for versatile applications.

Technical Specifications

Analog Waveform Generation SE555FKB attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5/15

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.89 mm

Trade Compliance

SE555FKB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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