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LM556CN/NOPB

Texas Instruments

LM556CN/NOPB by Texas Instruments

LM556CN/NOPB by Texas Instruments is a dual-function analog waveform generator with 14 terminals. It operates at supply voltages of 4.5-16V and has a temperature range of 0-70°C. This IC, in PLASTIC/EPOXY package, is ideal for pulse generation applications due to its BIPOLAR technology and rectangular package shape.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Adafruit Industries

USA . 75 parts In-Stock

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Vyrian

USA . 7,619 parts In-Stock

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Digiode

USA . 2,986 parts In-Stock

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Anansix

USA . 864 parts In-Stock

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Nova Conductors

Japan . 57 parts In-Stock

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Bristol Electronics

USA . 4 parts In-Stock

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Ampacity Inc.

Singapore . 75 parts In-Stock

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$2.500

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$2.500

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Semicontronic

India . 75 parts In-Stock

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$5.500

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$5.362

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$5.335

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AZTECH Wire

Italy . 297 parts In-Stock

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$6.288

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Corohmni

South Africa . 690 parts In-Stock

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Parana Technologies

USA . 37 parts In-Stock

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$13.154

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$1,221.567

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$11.839

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DigiPath Technology Company

USA . 63 parts In-Stock

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$14.484

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ChromeModa Solutions

Germany . 6,925 parts In-Stock

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IDEA Electronic Components Group

UK . 1,369 parts In-Stock

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$14.041

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CPlus Electronics

USA . 9,455 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,293 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,407 parts In-Stock

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Corphita

USA . 499 parts In-Stock

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Microchip USA

USA . 467 parts In-Stock

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Advanced Electronics

New Zealand . 75 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock endless possibilities with the LM556CN/NOPB by Texas Instruments, a premium Analog Waveform Generation IC that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this versatile product features dual functions and a wide supply voltage range, making it ideal for a variety of applications. From pulse generation to rectangular waveform synthesis, this IC provides high-performance solutions for all your analog waveform needs. Experience the value and benefits of Texas Instruments' cutting-edge technology with the LM556CN/NOPB. Elevate your projects to new heights with this innovative component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package lightweight and durable, suitable for various applications.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard supply voltage of 5V makes it compatible with most common power sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can perform reliably even under demanding conditions.

Technology: BIPOLAR

Utilizing bipolar technology allows for precise control and generation of analog waveforms.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering during installation.

Technical Specifications

Analog Waveform Generation LM556CN/NOPB attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

19.18 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

LM556CN/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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