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LM555J/883B

Texas Instruments

LM555J/883B by Texas Instruments

LM555J/883B by Texas Instruments is a MIL-STD-883 Class B Analog Waveform Generation IC with 8 terminals. It operates b/w -55 to 125 °C, with Vsup ranging from 4.5V to 18V. This rectangular package IC has a max output frequency of 0.051 GHz, making it ideal for military-grade applications requiring precise pulse generation.

Median Price

$19.980

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$19.980

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Vyrian

USA . 5,823 parts In-Stock

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Digiode

USA . 1,404 parts In-Stock

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Anansix

USA . 404 parts In-Stock

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Sunrise Surplus Inc.

USA . 3 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 475 parts In-Stock

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$0.500

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475

$0.500

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AZTECH Wire

Italy . 267 parts In-Stock

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$7.553

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Parana Technologies

USA . 1,281 parts In-Stock

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$10.699

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$11.187

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IDEA Electronic Components Group

UK . 2,002 parts In-Stock

1+ parts

$12.021

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$11.420

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$10.819

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2,002

$12.021

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ChromeModa Solutions

Germany . 923 parts In-Stock

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$12.021

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$9.857

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Corphita

USA . 3,342 parts In-Stock

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DigiPath Technology Company

USA . 1,634 parts In-Stock

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$10.838

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Overview

Unlock the potential of your analog waveform generation needs with the LM555J/883B by Texas Instruments. Trusted for its quality and reliability, this product offers exceptional value with its MIL-STD-883 Class B screening level and military-grade temperature grade. Perfect for a wide range of applications, this rectangular package style IC provides customers with precise and efficient performance. Experience the benefits of Texas Instruments' expertise in delivering top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent protection for the internal components, ensuring durability and reliability in various operating conditions.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage for efficient operation, ensuring stable performance.

Maximum Output Frequency: 0.051 GHz

Capable of generating waveforms at high frequencies, making it suitable for a wide range of applications.

No. of Terminals: 8

Sufficient number of terminals for versatile connectivity and integration into different systems.

Maximum Operating Temperature: 125 °C

Can operate effectively within a wide temperature range, suitable for demanding industrial environments.

Technology: BIPOLAR

Utilizes bipolar technology for accurate waveform generation and reliable performance.

Technical Specifications

Analog Waveform Generation LM555J/883B attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

.051 GHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

LM555J/883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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