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TLC556IDRG4

Texas Instruments

TLC556IDRG4 by Texas Instruments

TLC556IDRG4 by Texas Instruments is a dual-function analog waveform generator with a max output frequency of 1.2 GHz, suitable for applications requiring precise timing control. Operating at temperatures from 0 to 70°C, it features CMOS technology and requires a nominal voltage of 3V. With a small outline package style and gull wing terminal form, this IC is ideal for commercial-grade electronics in various industries.

Median Price

$1.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,445 parts In-Stock

1+ parts

-

100+ parts

$1.020

1k+ parts

$0.666

10k+ parts

$0.562

2,445

-

$1.020

$0.666

$0.562

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$0.692

-

-

-

Chip Stock

USA . 34,010 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

-

34,010

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-

-

-

North Shore Components

USA . 2,431 parts In-Stock

1+ parts

-

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2,431

-

-

-

-

Vyrian

USA . 2,052 parts In-Stock

1+ parts

-

100+ parts

-

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2,052

-

-

-

-

Digiode

USA . 1,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

1,679

-

-

-

-

Bristol Electronics

USA . 99 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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99

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,229 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

-

10k+ parts

$0.678

6,229

$0.692

-

-

$0.678

Argo Parts USA

USA . 3,397 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

-

10k+ parts

$0.671

3,397

$0.692

-

-

$0.671

Corohmni

South Africa . 108 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

-

10k+ parts

-

108

$0.692

-

-

-

Semicontronic

India . 2,120 parts In-Stock

1+ parts

$0.870

100+ parts

$0.848

1k+ parts

$0.844

10k+ parts

-

2,120

$0.870

$0.848

$0.844

-

Ampacity Inc.

Singapore . 1,991 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

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1,991

$0.870

-

-

-

Parana Technologies

USA . 1,937 parts In-Stock

1+ parts

$4.032

100+ parts

-

1k+ parts

$4.494

10k+ parts

-

1,937

$4.032

-

$4.494

-

IDEA Electronic Components Group

UK . 2,320 parts In-Stock

1+ parts

$4.530

100+ parts

-

1k+ parts

$4.077

10k+ parts

-

2,320

$4.530

-

$4.077

-

ChromeModa Solutions

Germany . 1,088 parts In-Stock

1+ parts

$4.530

100+ parts

$3.715

1k+ parts

-

10k+ parts

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1,088

$4.530

$3.715

-

-

Corphita

USA . 3,401 parts In-Stock

1+ parts

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3,401

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Microchip USA

USA . 2,983 parts In-Stock

1+ parts

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2,983

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-

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DigiPath Technology Company

USA . 2,012 parts In-Stock

1+ parts

-

100+ parts

$4.084

1k+ parts

-

10k+ parts

-

2,012

-

$4.084

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.678

1k+ parts

$0.657

10k+ parts

$0.644

1,000

-

$0.678

$0.657

$0.644

Overview

Elevate your analog waveform generation capabilities with the TLC556IDRG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliability and performance in every component they produce. The TLC556IDRG4 offers customers unparalleled value with its dual functions, small outline package style, and wide temperature range, making it ideal for a variety of applications. Whether you're designing pulse or rectangular waveforms, this versatile IC provides the precision and efficiency you need to bring your projects to life. Experience the benefits and advantages of Texas Instruments' TLC556IDRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the product long-lasting.

Surface Mount: YES

Allows for easy and efficient installation, suitable for modern electronic assembly techniques.

Nominal Supply Voltage (Vsup): 3 V

Operates at a low voltage, making it energy-efficient and suitable for a variety of applications.

Maximum Output Frequency: 1.2 GHz

Capable of generating high-frequency waveforms, making it ideal for applications requiring fast signal generation.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ensuring reliable performance in various environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Analog Waveform Generation TLC556IDRG4 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 5V OR 15V NOMINALS

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

1.2 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TLC556IDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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