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SE556FH/883B

Texas Instruments

SE556FH/883B by Texas Instruments

SE556FH/883B by Texas Instruments is a MILITARY-grade Analog Waveform Generator with 20 terminals. It operates b/w -55 to 125 °C, powered by 5/15V supplies. Suitable for military applications requiring precise waveform generation in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,392 parts In-Stock

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Digiode

USA . 201 parts In-Stock

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201

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Semicontronic

India . 725 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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725

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 201 parts In-Stock

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$4.500

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201

$4.500

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AZTECH Wire

Italy . 337 parts In-Stock

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$15.952

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337

$15.952

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Parana Technologies

USA . 453 parts In-Stock

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$17.078

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$17.295

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453

$17.078

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$17.295

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ChromeModa Solutions

Germany . 5,739 parts In-Stock

1+ parts

$19.189

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$15.735

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5,739

$19.189

$15.735

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IDEA Electronic Components Group

UK . 1,065 parts In-Stock

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$19.189

100+ parts

$18.230

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$17.270

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1,065

$19.189

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$17.270

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Corphita

USA . 1,541 parts In-Stock

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DigiPath Technology Company

USA . 1,013 parts In-Stock

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$17.301

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$17.301

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Corohmni

South Africa . 117 parts In-Stock

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Overview

Elevate your analog waveform generation capabilities with the SE556FH/883B by Texas Instruments. Crafted with precision and expertise, this military-grade product offers unparalleled quality and reliability. Perfect for a wide range of applications, this chip carrier package ensures optimal performance in extreme conditions. With power supplies ranging from 5 to 15 volts, this product delivers exceptional value and benefits to customers looking for superior waveform generation solutions. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, ensuring the product can operate efficiently at high temperatures.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space in the manufacturing process.

Screening Level: MIL-STD-883 Class B (Modified)

Meeting MIL-STD-883 Class B standards ensures high reliability and quality of the product, making it suitable for demanding military applications.

Power Supplies (V): 5/15

Support for multiple power supply voltage options gives flexibility in design and application, catering to different voltage requirements.

No. of Terminals: 20

With a higher number of terminals, there are more connection options available, allowing for versatile circuit designs and configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand harsh environments and perform reliably under extreme conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to function in cold climates or environments without any performance issues.

Temperature Grade: MILITARY

Being classified under military-grade temperature standards ensures the product's durability and reliability in rugged and challenging environments.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and accurate waveform generation capabilities, making it ideal for applications requiring precise analog signals.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact and space-saving designs, enabling the product to be used in devices with limited space for components.

Technical Specifications

Analog Waveform Generation SE556FH/883B attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5/15

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SE556FH/883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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