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LM1229YA

Texas Instruments

LM1229YA by Texas Instruments

LM1229YA by Texas Instruments is a 64-terminal Analog Waveform Generation IC with a supply voltage range of 4.75V to 5.25V. It features a thin profile flatpack package, CMOS technology, and operates b/w 0°C to 70°C. Ideal for applications requiring precise waveform generation in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,109 parts In-Stock

1+ parts

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6,109

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Anansix

USA . 1,432 parts In-Stock

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1,432

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Digiode

USA . 525 parts In-Stock

1+ parts

-

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525

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,397 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

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1,397

$4.500

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AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$12.700

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410

$12.700

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Parana Technologies

USA . 569 parts In-Stock

1+ parts

$14.259

100+ parts

$1,324.136

1k+ parts

$12.833

10k+ parts

-

569

$14.259

$1,324.136

$12.833

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DigiPath Technology Company

USA . 460 parts In-Stock

1+ parts

$15.701

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-

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460

$15.701

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IDEA Electronic Components Group

UK . 1,942 parts In-Stock

1+ parts

$16.021

100+ parts

$15.220

1k+ parts

$14.419

10k+ parts

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1,942

$16.021

$15.220

$14.419

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ChromeModa Solutions

Germany . 1,755 parts In-Stock

1+ parts

$16.021

100+ parts

$13.137

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1,755

$16.021

$13.137

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Corphita

USA . 3,296 parts In-Stock

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3,296

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Overview

Experience unparalleled performance and precision with the LM1229YA by Texas Instruments, a leader in analog waveform generation. This innovative product boasts top-tier quality and reliability, making it ideal for a wide range of applications. From industrial automation to medical devices, this versatile device offers unmatched value and benefits to customers seeking cutting-edge technology. Upgrade your projects with the LM1229YA and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options, allowing for versatile integration with other components or systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability even in demanding environments or applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in operation.

Technical Specifications

Analog Waveform Generation LM1229YA attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

LM1229YA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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