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TS556MDT

STMicroelectronics

TS556MDT by STMicroelectronics

TS556MDT by STMicroelectronics is a dual-function analog waveform generator with a max output frequency of 2 GHz. It operates b/w 2-16 V and withstands temperatures from -55 °C to 125 °C, making it ideal for military applications. Its compact SOIC package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,237 parts In-Stock

1+ parts

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4,237

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Anansix

USA . 1,616 parts In-Stock

1+ parts

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1k+ parts

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1,616

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Digiode

USA . 1,026 parts In-Stock

1+ parts

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1,026

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,997 parts In-Stock

1+ parts

$3.372

100+ parts

-

1k+ parts

$3.035

10k+ parts

-

1,997

$3.372

-

$3.035

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MKK Technologies

India . 1,392 parts In-Stock

1+ parts

$6.340

100+ parts

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10k+ parts

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1,392

$6.340

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DigiPath Technology Company

USA . 1,392 parts In-Stock

1+ parts

$6.340

100+ parts

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10k+ parts

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1,392

$6.340

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Corphita

USA . 2,996 parts In-Stock

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2,996

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Parana Technologies

USA . 1,225 parts In-Stock

1+ parts

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100+ parts

$4.032

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1,225

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$4.032

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Overview

Unlock precision and performance with the TS556MDT by STMicroelectronics—a leader in innovation. This dual-function analog waveform generator excels in diverse applications, from automotive to industrial systems, ensuring reliable operation across extreme temperatures. With its compact design and impressive output frequency, it offers unparalleled value for engineers seeking efficiency and quality. Elevate your projects with the trusted reliability of STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology enables compact design and ease of integration into modern electronic devices, enhancing overall performance.

No. of Functions: 2

With dual functionality, this product can serve multiple purposes, optimizing board space and reducing component count.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout and easy placement on printed circuit boards (PCBs), improving manufacturability.

Nominal Supply Voltage (Vsup): 3 V

A standard nominal supply voltage ensures compatibility with a wide range of devices, making it versatile for various applications.

Maximum Output Frequency: 2 GHz

The high output frequency capability allows for precise waveform generation in high-speed applications, making it suitable for advanced communications and signal processing.

Power Supplies (V): 2/12

Supporting multiple power supply voltages enhances flexibility in design, allowing for integration into different systems without requiring extensive modifications.

No. of Terminals: 14

With 14 terminals, this product provides sufficient connectivity options, facilitating easy integration with surrounding components and reducing layout complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, ensuring a compact solution without sacrificing performance.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this product suitable for harsh environments, ensuring reliability and longevity in demanding conditions.

Minimum Operating Temperature: -55 °C

With a broad temperature range, this product is suitable for applications in extreme environments, catering to various industrial and military needs.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and ensures long-lasting connections, contributing to overall circuit reliability.

Terminal Position: DUAL

Dual terminal positioning allows for better assembly options and simplified PCB layout, enhancing design flexibility.

Maximum Seated Height: 1.75 mm

The low seated height contributes to a compact design, making it suitable for portable and space-efficient applications.

Width: 3.9 mm

A narrow width allows for high-density packaging, making this product ideal for modern electronic devices with limited space.

Other IC type: PULSE; RECTANGULAR

This capability allows for versatile waveform generation, accommodating various signal conditioning needs in different applications.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage enhances compatibility with battery-powered devices, allowing for greater design flexibility.

Length: 8.65 mm

The compact length supports high-density configurations, making it suitable for integration into space-constrained designs.

Temperature Grade: MILITARY

Rated for military applications, this product ensures robustness and reliability in critical environments, meeting stringent testing and quality standards.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed performance, making it efficient for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improved mechanical stability, ensuring robust connections in electronic assemblies.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy routing on PCBs, suitable for high-density layouts without sacrificing performance.

Maximum Supply Voltage (Vsup): 16 V

The ability to handle a higher supply voltage provides design flexibility, accommodating various power supply architectures.

Technical Specifications

Analog Waveform Generation TS556MDT attributes and parameters. Explore more Analog Waveform Generation devices from STMicroelectronics

Specs

Additional Features:

IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TS556MDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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