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SA556-1N

NXP Semiconductors

SA556-1N by NXP Semiconductors

SA556-1N by NXP Semiconductors is a dual-function analog waveform generator with a max output frequency of 0.5 GHz. It operates in industrial conditions, supporting -40 °C to 85 °C and requires a supply voltage b/w 4.5V and 16V. Ideal for pulse applications, it features a compact 14-terminal design.

Median Price

$11.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$11.140

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Digiode

USA . 3,488 parts In-Stock

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Anansix

USA . 2,541 parts In-Stock

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Vyrian

USA . 1,816 parts In-Stock

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One Stop Electronics

USA . 491 parts In-Stock

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$0.500

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Corphita

USA . 2,311 parts In-Stock

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UNI Independent Distributors

Spain . 206 parts In-Stock

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Overview

Elevate your projects with the SA556-1N from NXP Semiconductors—an exceptional solution for analog waveform generation. Known for their commitment to quality and innovation, NXP delivers a robust device that excels in performance and reliability. With its versatile applications across industrial and commercial fields, the SA556-1N ensures precise signal generation, empowering engineers to achieve their design goals effortlessly. Experience unmatched value and efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection against environmental factors, ensuring longevity and reliability in various applications.

No. of Functions: 2

With dual functionality, this product offers versatility for a range of waveform generation applications, reducing the need for multiple devices.

Package Shape: RECTANGULAR

The rectangular shape is ideal for design efficiency in PCB layouts, optimizing space while maintaining performance.

Maximum Output Frequency: 0.5 GHz

An output frequency of 0.5 GHz allows it to handle high-speed applications, making it suitable for advanced communication and signal processing tasks.

No. of Terminals: 14

With 14 terminals, this IC provides ample connection options, facilitating easy integration into various circuit designs.

Package Style (Meter): IN-LINE

The in-line package style facilitates easier assembly on PCB, promoting efficient use of board real estate.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this component is capable of functioning reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

A wide temperature range, from -40 °C to 85 °C, ensures the product can perform in extreme conditions, enhancing its application scope.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in mounting options, accommodating various design requirements.

Maximum Seated Height: 4.2 mm

A compact seated height of 4.2 mm allows for high-density design applications without compromising performance.

Width: 7.62 mm

At 7.62 mm wide, this component strikes a balance between space-saving design and performance, fitting well into tight layouts.

Other IC type: PULSE

Being a pulse type IC enhances its suitability for generating precise timing signals in digital applications.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage of 4.5 V enables compatibility with a variety of low-voltage systems.

Length: 19.025 mm

The length of 19.025 mm provides a compact form factor, essential for modern electronics that require small footprints.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures reliability and performance in harsh operating conditions, ideal for industrial applications.

Maximum Supply Current (Isup): 30 mA

A maximum supply current of 30 mA allows for efficient power management while providing adequate output strength for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and ease of handling during assembly, ensuring robust connections.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is a standard size that promotes compatibility with traditional PCB design methods.

Maximum Supply Voltage (Vsup): 16 V

A maximum supply voltage of 16 V expands its application in various circuits, allowing it to interface with both low and higher-voltage systems.

Technical Specifications

Analog Waveform Generation SA556-1N attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SA556-1N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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