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TLC556CNP1

Texas Instruments

TLC556CNP1 by Texas Instruments

TLC556CNP1 by Texas Instruments is a CMOS analog waveform generator with 14 terminals, operating at temperatures from 0 to 70°C. It has dual terminal positions and uses power supplies of 5/18V. This rectangular package is ideal for commercial applications requiring precise waveform generation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,074 parts In-Stock

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3,074

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Digiode

USA . 2,886 parts In-Stock

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2,886

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Distributors (Availability)

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One Stop Electronics

USA . 238 parts In-Stock

1+ parts

$2.500

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238

$2.500

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Ampacity Inc.

Singapore . 1,393 parts In-Stock

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$4.500

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1,393

$4.500

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Parana Technologies

USA . 1,171 parts In-Stock

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$5.128

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$5.717

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1,171

$5.128

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$5.717

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Semicontronic

India . 1,532 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

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$5.335

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1,532

$5.500

$5.362

$5.335

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DigiPath Technology Company

USA . 370 parts In-Stock

1+ parts

$5.647

100+ parts

$5.195

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370

$5.647

$5.195

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ChromeModa Solutions

Germany . 4,452 parts In-Stock

1+ parts

$5.762

100+ parts

$4.725

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4,452

$5.762

$4.725

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IDEA Electronic Components Group

UK . 2,355 parts In-Stock

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$5.762

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$5.186

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2,355

$5.762

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$5.186

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AZTECH Wire

Italy . 600 parts In-Stock

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$6.364

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600

$6.364

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Corphita

USA . 1,802 parts In-Stock

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1,802

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Corohmni

South Africa . 474 parts In-Stock

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474

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Overview

Upgrade your analog waveform generation with the TLC556CNP1 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers superior performance and durability. This versatile component is ideal for a wide range of applications, offering customers unparalleled value and benefits. From precision timing in industrial automation to signal generation in test and measurement equipment, the TLC556CNP1 is the perfect choice for your electronic design needs. Trust Texas Instruments to provide you with the best in analog waveform generation technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material increases the durability and reliability of the product, making it suitable for various industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement within a system or circuit board, optimizing space usage.

Power Supplies (V): 5/18

The product can operate with two different power supplies, offering flexibility and compatibility with various voltage requirements.

No. of Terminals: 14

Having 14 terminals allows for connection to multiple devices or components, enhancing versatility in use.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy installation and connectivity arrangement, contributing to overall system efficiency.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function reliably even in cold environments, increasing its usability range.

Terminal Position: DUAL

The dual terminal position offers redundancy and improves the reliability of connections, reducing the risk of signal loss or disruption.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard industrial and commercial applications, ensuring compatibility with most operating environments.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and ensures secure connections, enhancing the product's durability and performance.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and connection of components, reducing assembly time and improving overall product efficiency.

Technical Specifications

Analog Waveform Generation TLC556CNP1 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/18

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TLC556CNP1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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