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ICM7555ID-T

NXP Semiconductors

ICM7555ID-T by NXP Semiconductors

ICM7555ID-T by NXP Semiconductors is a CMOS analog waveform generator with a max output frequency of 0.5 GHz and operates b/w -40 °C to 85 °C. It features an 8-terminal, dual-position design in a compact SO package. Ideal for industrial applications requiring precise pulse generation at supply voltages from 3V to 16V.

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1k+

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Anansix

USA . 2,234 parts In-Stock

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Vyrian

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Digiode

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Connector Distribution Corp

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Right Parts Inc.

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One Stop Electronics

USA . 757 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

Germany . 5,319 parts In-Stock

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Corphita

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Alle Elektronik GmbH

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Overview

Elevate your designs with the ICM7555ID-T from NXP Semiconductors—a benchmark in analog waveform generation. Crafted with precision, this versatile IC delivers exceptional performance in various applications, from timer circuits to pulse generation. With NXP's commitment to quality and innovation, you can trust that this component offers reliability, efficiency, and robust operation across wide temperature ranges, enhancing your project's value and longevity. Choose ICM7555ID-T for superior waveform control!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material enhances the longevity and reliability of the product, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into compact designs, saving space and improving performance.

Package Shape: RECTANGULAR

Rectangular shape optimizes layout efficiency on PCBs, facilitating a more straightforward assembly and better thermal management.

Nominal Supply Voltage (Vsup): 5 V

Standard supply voltage ensures compatibility with a wide range of systems and applications, simplifying design considerations.

Maximum Output Frequency: 0.5 GHz

High output frequency allows for precise waveform generation, making it ideal for high-speed applications.

No. of Terminals: 8

Having 8 terminals provides essential connectivity while maintaining a compact form factor, enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables high-density mounting, which is particularly beneficial in space-constrained designs.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable performance in harsh environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range provides versatility and reliability in extreme conditions, ideal for outdoor and industrial settings.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and can improve connection reliability.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact assembly and helps reduce overall system height.

Width: 3.9 mm

Narrow width facilitates space-saving designs, enabling more components on a single PCB.

Other IC Type: PULSE

Pulse generation capability broadens the application range, particularly in timing and control circuits.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement makes it energy-efficient and suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature: 40 s

Allows for extended reflow times, which can improve solder joint reliability during assembly.

Peak Reflow Temperature: 260 °C

High peak reflow temperature is compatible with modern soldering processes, ensuring robust assembly.

Length: 4.9 mm

Compact length contributes to space efficiency, allowing for more complex designs in smaller footprints.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring robust performance and reliability in demanding environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product suitable for battery-operated devices and sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve connection reliability, enhancing overall product performance.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with a wide range of PCB designs and enhances ease of assembly.

Maximum Supply Voltage (Vsup): 16 V

High maximum supply voltage provides design flexibility and the ability to accommodate various application requirements.

Technical Specifications

Analog Waveform Generation ICM7555ID-T attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

ICM7555ID-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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