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SE556FK/883B

Texas Instruments

SE556FK/883B by Texas Instruments

SE556FK/883B by Texas Instruments is a MIL-STD-883 Class B Analog Waveform Generation chip. It operates b/w -55 to 125 °C with power supplies of 5/15V. Ideal for military-grade applications due to its bipolar technology and ceramic package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,662 parts In-Stock

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Vyrian

USA . 2,263 parts In-Stock

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2,263

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Distributors (Availability)

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Semicontronic

India . 347 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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347

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 539 parts In-Stock

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$1.500

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539

$1.500

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One Stop Electronics

USA . 1,366 parts In-Stock

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$3.500

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1,366

$3.500

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AZTECH Wire

Italy . 357 parts In-Stock

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$5.536

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357

$5.536

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Parana Technologies

USA . 2,299 parts In-Stock

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$11.666

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$12.059

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2,299

$11.666

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$12.059

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DigiPath Technology Company

USA . 1,743 parts In-Stock

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$12.846

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$11.818

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1,743

$12.846

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

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$13.108

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$12.453

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$11.797

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1,398

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$11.797

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ChromeModa Solutions

Germany . 1,391 parts In-Stock

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$13.108

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$10.749

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$10.749

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Corphita

USA . 4,139 parts In-Stock

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Corohmni

South Africa . 396 parts In-Stock

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Overview

Elevate your analog waveform generation capabilities with the SE556FK/883B by Texas Instruments. With a reputation for excellence in manufacturing, this product offers unparalleled quality and reliability. Perfect for military-grade applications, this chip carrier package ensures optimal performance in extreme temperatures ranging from -55°C to 125°C. Trust Texas Instruments to deliver cutting-edge technology in every terminal, providing power supplies of 5/15V for seamless integration. Upgrade your waveform generation experience today with the SE556FK/883B.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a stable and durable material, providing good thermal conductivity and high temperature resistance, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology makes installation easier, saving time and effort during assembly while providing a compact form factor for space-constrained designs.

Screening Level: MIL-STD-883 Class B (Modified)

Conformance to MIL-STD-883 Class B standards ensures high reliability and quality, making the product suitable for demanding military or aerospace applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and facilitates uniform thermal dissipation, contributing to overall system performance.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5V and 15V) offers flexibility in designing circuits and compatibility with a wide range of systems.

No. of Terminals: 20

Having 20 terminals enables connectivity to various external components and interfaces, enhancing the product's versatility in signal generation applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides robust protection for internal circuitry and simplifies integration into electronic systems, ensuring long-term reliability and ease of handling.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand elevated thermal conditions without compromising performance, ideal for harsh environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C allows the product to function reliably in cold environments, expanding its usability in a wide range of applications.

Terminal Position: QUAD

Quad terminal position layout enhances signal integrity and ease of connection, ensuring stable performance and simplifying integration into existing electronic setups.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the product meets stringent reliability standards and can operate consistently in rugged conditions, making it suitable for defense or aerospace applications.

Technology: BIPOLAR

Bipolar technology offers high-speed operation, precise waveform generation capabilities, and low noise output, making the product ideal for demanding analog signal processing tasks.

Terminal Form: NO LEAD

No lead terminal form simplifies the soldering process, reducing the risk of electrical shorts and ensuring robust connections for long-term reliability in circuit applications.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the product supports high-density PCB layouts, enabling compact designs and efficient use of space in electronic systems.

Technical Specifications

Analog Waveform Generation SE556FK/883B attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5/15

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SE556FK/883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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