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SE555CJG

Texas Instruments

SE555CJG by Texas Instruments

SE555CJG by Texas Instruments is an Analog Waveform Generation IC with 8 terminals and a supply voltage range of 4.5V to 16V. It operates in temperatures from -55°C to 125°C, making it suitable for military-grade applications. The package style is in-line rectangular, with a ceramic, glass-sealed body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,611 parts In-Stock

1+ parts

-

100+ parts

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4,611

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Digiode

USA . 901 parts In-Stock

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901

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 419 parts In-Stock

1+ parts

$4.500

100+ parts

-

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419

$4.500

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AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$5.051

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519

$5.051

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Semicontronic

India . 1,036 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

1,036

$5.500

$5.362

$5.335

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Parana Technologies

USA . 374 parts In-Stock

1+ parts

$14.784

100+ parts

-

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$15.218

10k+ parts

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374

$14.784

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$15.218

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DigiPath Technology Company

USA . 1,333 parts In-Stock

1+ parts

$16.279

100+ parts

$14.976

1k+ parts

-

10k+ parts

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1,333

$16.279

$14.976

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ChromeModa Solutions

Germany . 1,593 parts In-Stock

1+ parts

$16.611

100+ parts

$13.621

1k+ parts

-

10k+ parts

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1,593

$16.611

$13.621

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IDEA Electronic Components Group

UK . 1,095 parts In-Stock

1+ parts

$16.611

100+ parts

$15.780

1k+ parts

$14.950

10k+ parts

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1,095

$16.611

$15.780

$14.950

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Corphita

USA . 4,170 parts In-Stock

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4,170

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Corohmni

South Africa . 481 parts In-Stock

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481

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Overview

Unleash the power of precision with the SE555CJG by Texas Instruments. As a leader in analog waveform generation technology, Texas Instruments delivers unparalleled quality and reliability in every product. The SE555CJG is a versatile solution for a wide range of applications, offering customers the value of efficient performance and seamless integration. Experience the benefits of superior design and engineering with the SE555CJG, providing you with the advantage you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability in various operating conditions.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V makes this product compatible with standard power supplies and easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to be used in harsh environments without compromising performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides easy and secure connections during installation and maintenance, ensuring a reliable connection for the product.

Technical Specifications

Analog Waveform Generation SE555CJG attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T8

Length:

9.6 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

SE555CJG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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