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TLC552CDRG4

Texas Instruments

TLC552CDRG4 by Texas Instruments

TLC552CDRG4 by Texas Instruments is a dual-function analog waveform generator with 1.2 GHz max output frequency and 18 V nominal voltage. Ideal for commercial applications, this CMOS technology IC operates b/w 0-70°C, featuring a small outline package style and nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,462 parts In-Stock

1+ parts

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8,462

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Digiode

USA . 2,940 parts In-Stock

1+ parts

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2,940

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 427 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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427

$0.500

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Semicontronic

India . 878 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

878

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 223 parts In-Stock

1+ parts

$2.500

100+ parts

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223

$2.500

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AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$6.688

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547

$6.688

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Parana Technologies

USA . 2,209 parts In-Stock

1+ parts

$7.181

100+ parts

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$7.688

10k+ parts

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2,209

$7.181

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$7.688

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DigiPath Technology Company

USA . 394 parts In-Stock

1+ parts

$7.908

100+ parts

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394

$7.908

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ChromeModa Solutions

Germany . 5,459 parts In-Stock

1+ parts

$8.069

100+ parts

$6.617

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5,459

$8.069

$6.617

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IDEA Electronic Components Group

UK . 276 parts In-Stock

1+ parts

$8.069

100+ parts

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1k+ parts

$7.262

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276

$8.069

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$7.262

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Corphita

USA . 2,536 parts In-Stock

1+ parts

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2,536

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Corohmni

South Africa . 171 parts In-Stock

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171

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Overview

Discover the world of precision analog waveform generation with the TLC552CDRG4 by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers a product that exceeds expectations. Ideal for a range of applications, this small outline package offers customers a versatile solution with maximum output frequency of 1.2 GHz and nominal supply voltage of 18 V. Experience the value and benefits of Texas Instruments' TLC552CDRG4 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 18 V

Allows for reliable and stable operation within the specified voltage range.

Maximum Output Frequency: 1.2 GHz

Provides high-frequency output signals, making it suitable for applications requiring fast and precise waveform generation.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments, expanding the range of potential use cases for the product.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Analog Waveform Generation TLC552CDRG4 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 1V OR 5V OR 15V OR 18V NOMINALS

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TLC552CDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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