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EF6840P

STMicroelectronics

EF6840P by STMicroelectronics

STMicroelectronics EF6840P is a 28-terminal Analog Waveform Generation IC with 5V supply voltage. It operates b/w 0-70 °C, suitable for commercial applications. The MOS technology chip has PLASTIC/EPOXY body in RECTANGULAR package style.

Median Price

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Lifecycle Status

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Digiode

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Vyrian

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Anansix

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Sogenti Electronics

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ICP Electronique

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Pegasus Components GmbH

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Connector Distribution Corp

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Right Parts Inc.

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ComSIT Distribution GmbH

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Bristol Electronics

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Inventory MP

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ECAB

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J2 Sourcing AB

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Ack Elektronik San.Tic.Ltd.Sti

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Atlantic Semiconductor

USA . 7 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 7 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 6 parts In-Stock

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LittleDiode

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Resion

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LWI Electronics Inc

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Q Components

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Digital Electronic Gebert Verwaltungs UG

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EMSNET

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Native Components

USA . 75 parts In-Stock

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Northwest PG Solutions

USA . 685 parts In-Stock

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IDEA Electronic Components Group

UK . 2,036 parts In-Stock

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MKK Technologies

India . 625 parts In-Stock

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DigiPath Technology Company

USA . 625 parts In-Stock

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Corphita

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Perfect Parts

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 1,487 parts In-Stock

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Parana Technologies

USA . 899 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 78 parts In-Stock

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Assy Fe

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Overview

Elevate your analog waveform generation capabilities with the EF6840P by STMicroelectronics. Known for their high-quality manufacturing, STMicroelectronics delivers top-notch products that cater to a wide range of applications. The EF6840P offers unparalleled value and benefits, providing customers with reliable performance and efficiency. Whether you're in need of precise signal generation or waveform shaping, this product is designed to meet your needs with ease. Upgrade your projects today with the EF6840P from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body helps in providing durability and reliability to the product, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate the product into existing systems.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and space-saving design, making it convenient for applications where space is a constraint.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures the product can withstand a range of environmental conditions, increasing its versatility.

Technology: MOS

The MOS technology used in the product provides high performance and efficiency, making it a reliable choice for analog waveform generation.

Technical Specifications

Analog Waveform Generation EF6840P attributes and parameters. Explore more Analog Waveform Generation devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

EF6840P Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-117-7830, 5962011177830

NIIN

011177830

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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