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EF68A40EM

STMicroelectronics

EF68A40EM by STMicroelectronics

STMicroelectronics EF68A40EM is a MOS technology Analog Waveform Generation chip with 28 terminals, operating b/w -55 °C to 125°C. It has a supply voltage of 5V and comes in a square-shaped plastic/epoxy package suitable for military-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,484 parts In-Stock

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3,484

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Digiode

USA . 518 parts In-Stock

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518

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Anansix

USA . 437 parts In-Stock

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437

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 308 parts In-Stock

1+ parts

$0.079

100+ parts

-

1k+ parts

-

10k+ parts

$0.076

308

$0.079

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$0.076

Northwest PG Solutions

USA . 50 parts In-Stock

1+ parts

$0.087

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-

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$0.076

50

$0.087

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-

$0.076

IDEA Electronic Components Group

UK . 1,750 parts In-Stock

1+ parts

$19.797

100+ parts

-

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$17.817

10k+ parts

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1,750

$19.797

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$17.817

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MKK Technologies

India . 476 parts In-Stock

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$37.226

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476

$37.226

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DigiPath Technology Company

USA . 476 parts In-Stock

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$37.226

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476

$37.226

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Parana Technologies

USA . 1,634 parts In-Stock

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100+ parts

$23.670

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1,634

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$23.670

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Corphita

USA . 1,450 parts In-Stock

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1,450

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Overview

Unleash the power of analog waveform generation with the EF68A40EM by STMicroelectronics. Crafted with precision and expertise, this product offers unmatched quality and reliability. Whether you're in the military sector or seeking innovative solutions for your project, this chip carrier package delivers exceptional performance at both high and low temperatures. With 28 terminals and a nominal supply voltage of 5V, the EF68A40EM is designed to meet your needs with ease. Trust STMicroelectronics to provide cutting-edge technology that pushes boundaries and unlocks endless possibilities for your applications. Elevate your projects today with the EF68A40EM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Facilitates easy and secure installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage level that is commonly used in electronic circuits, making the product compatible with a wide range of systems.

No. of Terminals: 28

Sufficient terminals for connecting to other components or devices, allowing for versatile integration within a larger system.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable performance in demanding environments without risk of overheating.

Technology: MOS

MOS technology offers high-speed operation and low power consumption, enhancing the efficiency and performance of the product.

Technical Specifications

Analog Waveform Generation EF68A40EM attributes and parameters. Explore more Analog Waveform Generation devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-N28

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

EF68A40EM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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