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SE556-1CN

NXP Semiconductors

SE556-1CN by NXP Semiconductors

SE556-1CN by NXP Semiconductors is a dual-function analog waveform generator with a max output frequency of 0.5 GHz. It operates in extreme temperatures from -55 °C to 125 °C and supports supply voltages b/w 4.5V and 16V, ideal for military applications. Its compact design features a rectangular package with 14 terminals for easy integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,006 parts In-Stock

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Anansix

USA . 2,015 parts In-Stock

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Digiode

USA . 1,483 parts In-Stock

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One Stop Electronics

USA . 1,021 parts In-Stock

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UNI Independent Distributors

Spain . 4,012 parts In-Stock

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Corphita

USA . 1,402 parts In-Stock

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Overview

Unlock superior performance with the SE556-1CN from NXP Semiconductors, a leader in innovative analog waveform generation. This versatile component delivers exceptional quality and reliability, perfect for military and industrial applications. With its dual functionality and robust temperature range, it ensures optimal operation in demanding environments. Elevate your designs with the SE556-1CN and experience unparalleled value that drives efficiency and enhances your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various operating conditions, making it suitable for demanding applications.

No. of Functions: 2

With two functions, this product provides versatility, allowing it to perform multiple tasks which can reduce the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and easily accommodated in various PCB layouts, facilitating compact designs.

Maximum Output Frequency: 0.5 GHz

A maximum output frequency of 0.5 GHz allows the device to generate high-frequency waveforms suitable for advanced applications in communication and signal processing.

No. of Terminals: 14

With 14 terminals, it offers multiple connection points, enhancing integration possibilities within various circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style allows for easier automated assembly in production processes, improving manufacturing efficiency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this device can function in high-temperature environments, making it suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

Its ability to operate at -55 °C ensures reliability in extreme cold environments, making it ideal for aerospace and military use.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design, allowing for efficient space utilization on PCBs.

Maximum Seated Height: 4.2 mm

A maximum seated height of 4.2 mm allows for a low-profile design, which is beneficial for compact electronic devices.

Width: 7.62 mm

A width of 7.62 mm makes the device compact and efficient, facilitating its integration into various space-constrained applications.

Other IC type: PULSE

As a pulse IC, this product is designed for precise timing applications, enhancing its effectiveness in signal generation tasks.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V allows for compatibility with a wide range of power supply options, making it flexible for different designs.

Length: 19.025 mm

A length of 19.025 mm provides a compact form factor, making it suitable for high-density applications.

Temperature Grade: MILITARY

Being rated for military temperature grades, this product is built to withstand harsh environments, ensuring reliability in critical applications.

Maximum Supply Current (Isup): 30 mA

The maximum supply current of 30 mA offers efficient power management while ensuring adequate performance for various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical stability and ease of soldering, making it suitable for rugged applications.

Terminal Pitch: 2.54 mm

A 2.54 mm terminal pitch enhances compatibility with standard PCB layouts, simplifying circuit design and assembly.

Maximum Supply Voltage (Vsup): 16 V

A maximum supply voltage of 16 V allows for flexibility in power environments, making this product versatile across various applications.

Technical Specifications

Analog Waveform Generation SE556-1CN attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SE556-1CN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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